IP Library Granted Patent US 8,659,074
Granted Patent B2
US 8,659,074 · App. 11/971,123 · Granted Feb 25, 2014

Semiconductor device

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Quick Facts
Patent No.
US 8,659,074
App. No.
11/971,123
Granted
Feb 25, 2014
Kind
B2
Abstract

A semiconductor device includes a semiconductor layer of a first conductivity type and a semiconductor layer of a second conductivity type formed thereon. The semiconductor device also includes a body layer extending a first predetermined distance into the semiconductor layer of the second conductivity type and a pair of trenches extending a second predetermined distance into the semiconductor layer of the second conductivity type. Each of the pair of trenches consists essentially of a dielectric material disposed therein and a concentration of doping impurities present in the semiconductor layer of the second conductivity type and a distance between the pair of trenches define an electrical characteristic of the semiconductor device. The semiconductor device further includes a control gate coupled to the semiconductor layer of the second conductivity type and a source region coupled to the semiconductor layer of the second conductivity type.

Claims (26)

1. A semiconductor device comprising:

one or more first trenches which include a gate electrode, said gate electrode being capacitively coupled to a semiconductor material to control conduction therethrough; and

one or more second trenches, interspersed with said first trenches, and each having intentionally introduced spatially fixed net charge in dielectric material therein on sidewalls thereof;

wherein said second trenches at least partially balance the net charge in depleted regions of said semiconductor material, when said semiconductor material is depleted.

2. The semiconductor active device of claim 1 , wherein said intentionally introduced spatially fixed net charge comprises immobile ions inside the dielectric material on sidewalls of said one or more second trenches.

3. The semiconductor active device of claim 1 , wherein said intentionally introduced spatially fixed net charge comprises immobile ions inside the dielectric material on sidewalls of said one or more second trenches, and said ions have a spatial distribution which generally corresponds to implantation through at least one sidewall of each said one or more second trenches.

4. The semiconductor active device of claim 1 , wherein said intentionally introduced spatially fixed net charge comprises immobile ions having a spatial distribution which generally corresponds to implantation through at least one sidewall of each said one or more second trenches.

5. The semiconductor active device of claim 1 , wherein said semiconductor material is silicon.

6. A semiconductor active device comprising:

one or more first trenches which each include a gate electrode, said gate electrode being coupled to a first-conductivity-type semiconductor body to control inversion thereof, and thereby allow or deny passage of majority carriers from a second-conductivity-type source region though said first-conductivity-type semiconductor body, and a semiconductor drift region, to a second-conductivity-type drain region; and

one or more second trenches which are interspersed with said first trenches, and which include intentionally introduced spatially fixed net charge, in dielectric material therein, which is located in proximity to sidewalls of said trenches, and which is capacitively coupled to at least part of said semiconductor drift region;

wherein said second trenches at least partially balance the net charge in depleted portions of said semiconductor drift region, when such depletion occurs.

7. The semiconductor active device of claim 6 , wherein said intentionally introduced spatially fixed net charge comprises immobile ions inside the dielectric material on sidewalls of said one or more second trenches.

8. The semiconductor active device of claim 6 , wherein said intentionally introduced spatially fixed net charge comprises immobile ions inside the dielectric material on sidewalls of said one or more second trenches, and said ions have a spatial distribution which generally corresponds to implantation through at least one sidewall of each said one or more second trenches.

9. The semiconductor active device of claim 6 , wherein said intentionally introduced spatially fixed net charge comprises immobile ions having a spatial distribution which generally corresponds to implantation through at least one sidewall of each said one or more second trenches.

10. The semiconductor active device of claim 6 , wherein said first-conductivity-type semiconductor body is p type, and said majority carriers are electrons.

11. The semiconductor active device of claim 6 , wherein said semiconductor drift region comprises silicon.

12. A semiconductor active device comprising:

one or more first insulated trenches which each include a respective gate electrode which is capacitively coupled to a first-conductivity-type semiconductor body to control inversion thereof, and thereby allow or deny passage of majority carriers from a second-conductivity-type source region though said first-conductivity-type semiconductor body, and a semiconductor drift region, to a second-conductivity-type drain region; and

one or more second insulated trenches which are interspersed with and deeper than said first trenches, and which include intentionally introduced spatially fixed net charge, in dielectric material therein, which is located in proximity to sidewalls of said trenches, and which is capacitively coupled to at least part of said semiconductor drift region and said first-conductivity-type semiconductor body;

wherein said second trenches at least partially balance the net charge in depleted portions of said semiconductor drift region, when such depletion occurs.

13. The semiconductor active device of claim 12 , wherein said intentionally introduced spatially fixed net charge comprises immobile ions inside the dielectric material on sidewalls of said one or more second trenches.

14. The semiconductor active device of claim 12 , wherein said intentionally introduced spatially fixed net charge comprises immobile ions inside the dielectric material on sidewalls of said one or more second trenches, and said ions have a spatial distribution which generally corresponds to implantation through at least one sidewall of each said one or more second trenches.

15. The semiconductor active device of claim 12 , wherein said intentionally introduced spatially fixed net charge comprises immobile ions having a spatial distribution which generally corresponds to implantation through at least one sidewall of each said one or more second trenches.

16. The semiconductor active device of claim 12 , wherein said first-conductivity-type semiconductor body is p type, and said majority carriers are electrons.

17. The semiconductor active device of claim 12 , wherein said semiconductor drift region comprises silicon.

Assignments (2)
SECURITY INTEREST Recorded Dec 27, 2022
From: MAXPOWER SEMICONDUCTOR, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 062228/0648 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 22, 2008
From: DARWISH, MO N.
To: MAXPOWER SEMICONDUCTOR, INC.
Reel/Frame 020548/0560 →