Multiple access over proximity communication
A multiple access Proximity Communication system in which electrical elements on an integrated circuit chip provide the multiplexing of multiple signals to a single electrical receiving element on another chip. Multiple pads formed on one chip and receiving separate signals may be capacitively coupled to one large pad on the other chip. Multiple inductive coils on one chip may be magnetically coupled to one large coil on another chip or inductive coils on three or more chips may be used for either transmitting or receiving. The multiplexing may be based on time, frequency, or code.
1. An inter-substrate communication system, comprising:
a plurality of substrates arranged together in a stack;
on at least a first one of the substrates, a plurality of electrical transmitting elements, wherein each of the transmitting elements transmits a signal in a corresponding separate channel from a set of channels during a different assigned time slot in a set of time slots, wherein each transmitting element is active in its assigned time slot and is inactive during all time slots in the set of time slots except its assigned time slot, and wherein the electrical transmitting elements include a plurality of transmitting pads;
on at least a second one of the substrates, an electrical receiving element electrically coupled to the electrical transmitting elements, wherein the electrical receiving element includes a receiving pad in physical opposition to all of the transmitting pads, wherein an area of the receiving pad is larger than an area encompassing all of the transmitting pads to facilitate signal coupling, and wherein the electrical receiving element is coupled to a de-multiplexer on the second substrate.
2. The system of claim 1 , wherein the electrical transmitting and receiving elements form capacitively coupled elements therebetween.
3. The system of claim 1 , wherein the first one of the substrates includes a plurality lines conveying multiplexed data signals multiplexed between them to the respective transmitting elements.
4. An inter-substrate communication system, comprising:
a first substrate having formed on its surface a plurality of transmitting pads and including respective drivers receiving respective data signals and driving respective ones of the transmitting pads, wherein each of the drivers drives a corresponding separate channel from a set of channels to the corresponding transmitting pad during a different assigned time slot in a set of time slots, and wherein each driver is active in its assigned time slot and is inactive during all time slots in the set of time slots except its assigned time slot; and
a second substrate positioned adjacent to the first substrate and having formed on its surface a receiving pad in opposition to and capacitively coupled to all of the transmitting pads, wherein an area of the receiving pad is larger than an area encompassing all of the transmitting pads, and wherein the receiving pad is coupled to a de-multiplexer on the second substrate.