Method and apparatus for chalcogenide device formation
View Patent ↗Chalcogenide devices are delineated and sidewalls of the devices are sealed, in an anaerobic and/or anhydrous environment environment. Throughout the delineation and sealing steps, and any intervening steps, the sidewalls are not exposed to oxygen or water. In an illustrative embodiment, a cluster tool includes an etching tool and a sealing/deposition tool configured to etch and seal the chalcogenide devices and to maintain the devices in an anaerobic and/or anhydrous environment throughout the process.
1. A method comprising:
providing a first processing chamber, said first processing chamber including a substrate having a layer of chalcogenide material formed thereon, said first processing chamber being equipped with a first load lock;
controlling the environment of said first processing chamber, said controlling including establishing anhydrous or anaerobic conditions in said first processing chamber;
removing a portion of said layer of chalcogenide material, said removing forming a sidewall surface of said chalcogenide material;
controlling the environment of said first load lock, said controlling including establishing anhydrous or anaerobic conditions in said first load lock;
transferring said substrate with said chalcogenide material having said sidewall layer from said first processing chamber to said first load lock;
attaching a portable transport box to said first load lock;
controlling the environment of said transport box, said controlling including establishing anhydrous or anaerobic conditions in said transport box;
transferring said substrate with said chalcogenide material having said sidewall surface from said first load lock to said transport box;
sealing said transport box;
detaching said transport box from said first load lock; and
conveying said transport box through air to a second processing chamber, said second processing chamber being equipped with a second load lock.
2. The method of claim 1 , wherein said second processing chamber is not connected to said first processing chamber.
3. The method of claim 1 , further comprising attaching said transport box to said second load lock.
4. The method of claim 3 , further comprising controlling the environment of said second load lock, said controlling including establishing anhydrous or anaerobic conditions in said second load lock.
5. The method of claim 4 , further comprising transferring said substrate with said chalcogenide material having said sidewall surface from said transport box to said second load lock.
6. The method of claim 5 , further comprising controlling the environment of said second processing chamber, said controlling including establishing anhydrous or anaerobic conditions in said second processing chamber.
7. The method of claim 6 , further comprising transferring said substrate with said chalcogenide material having said sidewall surface from said second load lock to said second processing chamber.
8. The method of claim 7 , further comprising forming a protective layer on said sidewall surface.