Methods and systems for semiconductor structure processing using multiple laser beam spots
Methods and systems selectively irradiate structures on or within a semiconductor substrate using multiple laser beams. The structures may be laser-severable conductive links, and the purpose of the irradiation may be to sever selected links.
1. A method comprising:
generating a first laser beam propagating to a first spot on or within a semiconductor wafer containing a plurality of structures to be selectively processed by laser irradiation, the semiconductor wafer defining a plane;
generating a second laser beam spatially separated from the first laser beam and propagating to a second spot non-overlapping with the first spot on or within the semiconductor wafer;
steering at least one of the first and second laser beams in a first direction within the plane; and
simultaneously with and independently of said steering step, steering at least one of the first and second laser beams in a second direction within the plane and orthogonal to the first direction.
2. A method according to claim 1 , wherein the step of steering at least one of the first and second laser beams in a first direction operates on the first laser beam, and the step of steering at least one of the first and second laser beams in a second direction operates on the second laser beam.
3. A method according to claim 1 , wherein both steering steps operate on the first laser beam.
4. A method according to claim 3 , wherein both steering steps are implemented using a two-axis steering device.
5. A method according to claim 3 , wherein the steering steps are implemented using two single-axis steering devices.