LED packaged structure and applications of LED as light source
View Patent ↗LED packaged structures and applications thereof are disclosed, characterized in that: an active layer in the LED or the LED packaged structure is formed on a first semiconductor conductive layer with multi-quantum wells; and a second semiconductor conductive layer is formed on the active layer; wherein a plurality of particles formed by at least one hetero-material are scattered between the first semiconductor conductive layer and the active layer in order to form an uneven multi-quantum well.
1. A LED packaged structure, comprising a frame, at least a LED component disposed on the frame, and a packaging resin enclosed around the LED component; characterized in that the LED component includes:
a substrate;
a first semiconductor conductive layer formed over the substrate;
an active layer having a plurality of uneven multi-quantum wells formed over the first semiconductor conductive layer;
a second semiconductor conductive layer formed over the active layer; and
a transparent conductive layer formed over the second semiconductor conductive layer;
wherein a plurality of particles formed by at least one hetero-material are scattered on the first semiconductor conductive layer directly so as to form the plurality of uneven multi-quantum wells.
2. The LED packaged structure according to claim 1 , wherein each one of the uneven multi-quantum wells has a cross section with a ratio of width to height in a range between 3 to 1 and 1 to 10.
3. The LED packaged structure according to claim 1 , wherein each one of uneven multi-quantum wells has a surface roughness Ra in a range between 0.5 and 50 nanometers.
4. The LED packaged structure according to claim 1 , wherein each one of uneven multi-quantum wells has a surface roughness Ra in a range between 30 and 40 nanometers.