Semiconductor device with grounding structure
View Patent ↗Conductions and vias between different, stacked metallic layers of a semiconductor device may be mechanically damaged by mechanical strain. According to an exemplary embodiment of the present invention, this mechanical strain may be transferred through the layer structure to the substrate by a grid of grounding structures and isolation and passivation layers which are connected by the grounding structures. This may provide for an enhancement of the lifetime of the semiconductor devices.
1. Supporting structure for supporting an isolation and passivation layer in a semiconductor device, the supporting structure comprising:
a first grounding structure adapted for connecting a first layer of the semi-conductor device via a metal layer to a lower second layer of the semiconductor device.
2. The supporting structure of claim 1 ,
wherein the first layer is a first isolation and passivation layer; and
wherein the second layer is one of a second isolation and passivation layer and a substrate.
3. The supporting structure of claim 1 ,
wherein the first grounding structure comprises a material with a first hardness;
wherein the metal layer comprises a material with a second hardness; and
wherein the first hardness is significantly bigger than the second hardness.
4. The supporting structure of claim 1 ,
wherein the first grounding structure is mechanically hard and stable and comprises a material selected from the group consisting of thermal oxide, silicon dioxide, silicon nitride, and titanium.
5. The supporting structure of claim 1 ,
wherein the semiconductor device comprises at least one of a metallic via and a bond pad; and
wherein the first grounding structure is arranged in an edge section of the metallic via or in an edge section of the bond pad.
6. The supporting structure of claim 1 ,
further comprising a second grounding structure adapted for connecting the first layer of the semiconductor device via the metal layer to the lower second layer of the semiconductor device;
wherein the first grounding structure and the second grounding structure are arranged along a direction of a thermo mechanical strain induced by a plastic moulding on top of the device.
7. The supporting structure of claim 6 ,
further comprising a third grounding structure adapted for connecting one of the first layer and the second layer to a lower third layer of the semiconductor device;
wherein the third layer of the semiconductor device is part of a substrate.
8. The supporting structure of claim 1 ,
wherein the first layer is a dielectric layer.
9. Semiconductor device with a supporting structure for supporting an isolation and passivation layer in the semiconductor device, the supporting structure comprising:
a first grounding structure adapted for connecting a first layer of the semiconductor device via a metal layer to a lower second layer of the semiconductor device.
10. The semiconductor device of claim 9 ,
wherein the first layer is a first isolation and passivation layer; and
wherein the second layer is one of a second isolation and passivation layer and a substrate.
11. Method of supporting an isolation and passivation layer in a semiconductor device, the method comprising the step of:
providing a first grounding structure adapted for connecting a first layer of the semiconductor device via a metal layer to a lower second layer of the semiconductor device.
12. The method of claim 11 ,
wherein the first layer is a first isolation and passivation layer; and
wherein the second layer is one of a second isolation and passivation layer and a substrate.
13. The method of claim 11 ,
wherein the provision of the first grounding structure comprises the step of:
intrinsically growing, on the substrate, a thermal oxide of a substrate material of the semiconductor device.
14. The method of claim 13 ,
wherein growing of the thermal oxide is performed by thermal oxidizing a surface of the substrate, resulting in an oxide layer; and
structuring the oxide layer, resulting in a plurality of single grounding structures.
15. The method of claim 14 ,
wherein structuring of the oxide layer comprises an etching step.
16. The method of claim 14 ,
wherein the single grounding structures are arranged along an edge section of a metallic via or an edge section of a bond pad.
17. The method of claim 14 ,
wherein the single grounding structures are arranged along a direction of a thermo mechanical strain.
18. The method of claim 14 ,
wherein the single grounding structures are arranged in a periodical manner.
19. The method of claim 12 ,
further comprising the step of providing a third grounding structure adapted for connecting one of the first layer and the second layer to a lower third layer of the semiconductor device;
wherein the third layer of the semiconductor device is part of the substrate.