IP Library › Granted Patent US 8,003,198
Granted Patent B2
US 8,003,198 · App. 11/997,766 · Granted Aug 23, 2011

Flexible printed conductive fabric and method for fabricating the same

Assignee: Kolon Glotech, Inc.
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Quick Facts
Patent No.
US 8,003,198
App. No.
11/997,766
Granted
Aug 23, 2011
Kind
B2
Abstract

A conductive fabric is provided. The conductive fabric comprises a base layer composed of a synthetic, regenerated or natural fiber, a conductive layer formed on the base layer to be capable of being freely formed by a pre-designed electric pattern, and an insulating layer formed on the conductive layer to protect the conductive layer from damage.

Claims (41)

1. A conductive fabric comprising,

a base layer composed of a synthetic, regenerated or natural fiber that is not impregnated with a resin,

a conductive layer formed on a surface of the base layer to be capable of being freely formed by a pre-designed electric pattern, and

an insulating layer formed on the conductive layer to protect the conductive layer from damage.

2. The conductive fabric according to claim 1 , further comprising a primer layer formed a surface of the base layer without impregnating the base layer and being disposed between the base layer and the conductive layer to make the surface of the base layer uniform.

3. The conductive fabric according to claim 2 , wherein the primer layer is formed of at least one resin selected from the group consisting of polyurethane, acrylic and silicone resins.

4. The conductive fabric according to claim 2 , wherein the primer layer is formed in a multilayer structure with a water-repellent layer.

5. The conductive fabric according to claim 1 , wherein the conductive layer is formed of at least one material selected from the group consisting of a conductive polymer, carbon, a metal material, and a mixture thereof with a binder.

6. The conductive fabric according to claim 5 , wherein the conductive polymer is selected from the group consisting of polyaniline, polypyrrole, polythiophene, and mixtures thereof.

7. The conductive fabric according to claim 5 , wherein the metal material and the binder are mixed in a weight ratio of 90:10 to 80:20 to form the conductive layer.

8. The conductive fabric according to claim 5 , wherein the binder is selected from the group consisting of polyurethane resins, acrylic resins, silicone resins, melamine resins, epoxy resins, and mixtures thereof.

9. The conductive fabric according to claim 8 , wherein the binder is a water-dispersible polyurethane resin.

10. The conductive fabric according to claim 1 , wherein the conductive layer has a thickness of 2 μm to 500 μm.

11. The conductive fabric according to claim 10 , wherein the conductive layer has a thickness of 10 μm to 20 μm.

12. The conductive fabric according to claim 1 , wherein the conductive layer has a width of 10 mm to 20 mm.

13. The conductive fabric according to claim 1 , wherein the insulating layer is formed by coating, printing or laminating at least one resin selected from the group consisting of polyurethane, acrylic, silicone, polyester, polyvinyl chloride (PVC) and polytetrafluoroethylene (PTFE) resins on the conductive layer.

14. The conductive fabric according to claim 1 , wherein the conductive layer has one or more the enlarged portions of bent portions of a circuit whose width is larger than that of linear portions of the circuit.

15. The conductive fabric according to claim 14 , wherein the enlarged portions have a circular or oval shape.

16. The conductive fabric according to claim 1 , wherein the conductive fabric has a resistance difference of 0.5Ω to 4Ω before and after washing.

17. A method for fabricating a conductive fabric, the method comprising the steps of

forming a conductive layer, through which electricity flows, on a surface of a base layer composed of a synthetic, regenerated or natural fiber that is not impregnated with a resin, and

forming an insulating layer on the conductive layer to protect the conductive layer from damage.

18. The method according to claim 17 , further comprising forming a primer layer on a surface of the base layer without impregnating the base layer to maintain the thickness of the conductive layer at a constant level.

19. The method according to claim 18 , wherein the primer layer is formed in a multilayer structure with a water-repellent layer.

20. The method according to claim 17 , further comprising calendering the base layer using a pressing roller before the formation of the conductive layer to make the surface of the base layer smooth, make up pores of the base layer and enhance the flex resistance of the conductive fabric.

21. The method according to claim 17 , further comprising breathable waterproofing/waterproofing the base layer after the calendering step to make up pores of the conductive layer and enhance the insulating properties, wash resistance and flex resistance of the conductive fabric.

22. The method according to claim 18 or 19 , wherein the primer layer is formed by knife rolling, over roll coating, floating knife coating, or knife over roll coating.

23. The method according to claim 18 or 19 , wherein the primer layer is formed of at least one resin selected from the group consisting of polyurethane, acrylic and silicone resins.

24. The method according to claim 17 , wherein the conductive layer is formed of at least one material selected from the group consisting of a conductive polymer, carbon, a metal material, and a mixture thereof with a binder.

25. The method according to claim 24 , wherein the conductive polymer is selected from the group consisting of polyaniline, polypyrrole, polythiophene, and mixtures thereof.

26. The method according to claim 24 , wherein the metal material and the binder are mixed in a weight ratio of 90:10 to 80:20 to form the conductive layer.

27. The method according to claim 24 , wherein the binder is selected from the group consisting of polyurethane resins, acrylic resins, silicone resins, melamine resins, epoxy resins, and mixtures thereof.

28. The method according to claim 27 , wherein the binder is a water dispersible polyurethane resin.

29. The method according to claim 17 , wherein the conductive layer has a thickness of 2 μm to 500 μm.

30. The method according to claim 29 , wherein the conductive layer has a thickness of 10 μm to 20 μm.

31. The method according to claim 17 , wherein the conductive layer has a width of 10 mm to 20 mm.

32. The method according to claim 17 , wherein the insulating layer is formed by coating, printing or laminating at least one resin selected from the group consisting of polyurethane, acrylic, silicone, polyester, polyvinyl chloride (PVC) and polytetrafluoroethylene (PTFE) resins on the conductive layer.

33. The method according to claim 32 , wherein the insulating layer is formed by dry coating, hot-melt dot lamination or gravure lamination.

34. The method according to claim 17 , wherein the conductive layer has one or more the enlarged portions of bent portions of a circuit whose width is larger than that of linear portions of the circuit.

35. The method according to claim 34 , wherein the enlarged portions have a circular or oval shape.

36. The method according to claim 17 , wherein the conductive fabric has a resistance difference of 0.5Ω to 4Ω before and after washing.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 4, 2008
From: PARK, SUNG MEE; CHO, KWANG SU; CHUNG, KYUNG HEE
To: KOLON GLOTECH, INC.
Reel/Frame 020458/0736 →
Priority Claims (2)
KR 10-2006-0112274 · Nov 14, 2006 · national
KR 10-2007-0070173 · Jul 12, 2007 · national
Continuity (1)
Related Publication 20100279086A1 · Nov 4, 2010