Selfbonding enamels based on new polyester amide imides and polyester amides
A selfbonding enamel containing resins which are capable of crosslinking with one another, comprising (A) 5 to 95 wt % of at least one resin with nucleophilic groups selected from the group consisting of OH, NHR, SH, C(O)NHR, carboxylate, CH-acidic groups and Carbanions, (B) 0 to 70 wt % of at least one amide group-containing resin and (C) 0 to 30 wt % of at least one polyurethane resin, (D) 0 to 30 wt % of at least one epoxy resin, (E) 5 to 95 wt % of at least one organic solvent, wherein the resins of either component (A) and/or, if component (B) is contained in the composition, component (B) contain α-carboxy-β-oxocycloalkyl carboxylic acid amide groups the coatings of the selfbonding enamel have excellent adhesion to electrically conductive wires high sticking properties and high re-softening temperatures.
1. A selfbonding enamel containing resins with nucleophilic groups which are capable of crosslinking with one another, comprising
(A) 5 to 95 wt % of at least one resin with nucleophilic groups the resin selected from the group consisting of polyamides, polyester imides, and polyesters,
(B) 1 to 70 wt % of at least one amide group-containing resin,
(C) 0 to 30 wt % of at least one polyurethane resin,
(D) 0 to 30 wt % of at least one epoxy resin,
(E) 5 to 95 wt % of at least one organic solvent,
wherein the resins of component (B) are the reaction product of 1-carboxy-2-oxocycloalkane or an alkyl or aryl ester thereof with an isocyanate under basic conditions, wherein the isocyanate is selected from the group consisting of propylene diisocyanate, trimethylene diisocyanate, tetramethylene diisocyanate, pentamethylene diisocyanate, hexamethylene diisocyanate, ethylethylene diisocyanate, 3,3,4-trimethyl hexamethylene diisocyanate, 1,3-cyclopentyl diisocyanate, 1,4-cyclohexyl diisocyanate, 1,2-cyclohexyl diisocyanate, 1,3-phenylene diisocyanate, 1,4-phenylene diisocyanate, 2,5-toluoylene diisocyanate, 2,6-toluoylene diisocyanate, 4,4′-biphenylene diisocyanate, 1,5-naphthylene diisocyanate, 1,4-naphthylene diisocyanate, 4,4′diphenylmethane diisocyanate, 2,4′-diphenylmethane diisocyanate, 4,4′dicyclohexylmethane diisocyanate, 2,4′-dicyclohexylmethane diisocyanate, isophorone diisocyanate, triisocyanatononane, and uretdiones or isocyanurates therefrom, and of further reaction with a polyester imide resin; and wherein, the percent by weight is based on the total selfbonding enamel.
2. The selfbonding enamel according to claim 1 comprising
(A) 5 to 60 wt % of at least one resin with nucleophilic groups the resin selected from the group consisting of polyamides, polyester imides, and polyesters,
(B) 1 to 50 wt % of at least one amide group-containing resin,
(C) 0 to 30 wt % of at least one polyurethane resin,
(D) 0 to 30 wt % of at least one epoxy resin,
(E) 5 to 90 wt % of at least one organic solvent,
(F) 0 to 10 wt % of at least one catalyst,
(G) 0 to 20 wt % of at least one phenolic resin and/or melamine resin and/or blocked isocyanate,
(H) 0 to 3 wt % of conventionally used additives or auxiliaries,
(I) 0 to 70 wt % of nano-scale particles, and
(J) 0 to 60 wt % of conventionally used fillers and/or pigments
wherein the percent by weight is based on the total selfbonding enamel.
3. The selfbonding enamel according to claim 1 wherein the α-carboxy-β-oxocycloalkyl carboxylic acid amide groups of component (B) are in a terminal position.
4. The selfbonding enamel according to claim 2 wherein the nano scale particles are reactive with component A) and/or B).
5. The selfbonding enamel according to claim 1 wherein monomeric and/or polymeric element-organic compounds are contained.
6. A process for coating electrically conductive wires comprising the steps
(a) applying the selfbonding enamel of claim 1 on the wire, and
(b) drying the applied enamel.
7. The process according to claim 6 wherein the wire is a pre-coated wire.
8. A coated substrate coated with the selfbonding enamel according to claim 1 .
9. A selfbonding enamel containing resins with nucleophilic groups which are capable of crosslinking with one another, consisting of:
(A) 5 to 95 wt % of at least one resin with nucleophilic groups the resin selected from the group consisting of polyamides, polyester imides, and polyesters,
(B) 1 to 70 wt % of at least one amide group-containing resin,
(C) 0 to 30 wt % of at least one polyurethane resin,
(D) 0 to 30 wt % of at least one epoxy resin,
(E) 5 to 95 wt % of at least one organic solvent,
(F) 0 to 10 wt % of at least one catalyst,
(G) 0 to 20 wt % of at least one phenolic resin and/or melamine resin,
(H) 0 to 3 wt % of additives or auxiliaries,
(I) 0 to 70 wt % of nano-scale particles, and
(J) 0 to 60 wt % of fillers and/or pigments
wherein the resins of component (B) are the reaction product of 1-carboxy-2-oxocycloalkane or an alkyl or aryl ester thereof with an isocyanate under basic conditions, wherein the isocyanate is selected from the group consisting of propylene diisocyanate, trimethylene diisocyanate, tetramethylene diisocyanate, pentamethylene diisocyanate, hexamethylene diisocyanate, ethylethylene diisocyanate, 3,3,4-trimethyl hexamethylene diisocyanate, 1,3-cyclopentyl diisocyanate, 1,4-cyclohexyl diisocyanate, 1,2-cyclohexyl diisocyanate, 1,3-phenylene diisocyanate, 1,4-phenylene diisocyanate, 2,5-toluoylene diisocyanate, 2,6-toluoylene diisocyanate, 4,4′-biphenylene diisocyanate, 1,5-naphthylene diisocyanate, 1,4-naphthylene diisocyanate, 4,4′diphenylmethane diisocyanate, 2,4′-diphenylmethane diisocyanate, 4,4′dicyclohexylmethane diisocyanate, 2,4′-dicyclohexylmethane diisocyanate, isophorone diisocyanate, triisocyanatononane, and uretdiones or isocyanurates therefrom, and of further reaction with a polyester imide resin; and wherein, the percent by weight is based on the total selfbonding enamel.
10. A selfbonding enamel containing resins with nucleophilic groups which are capable of crosslinking with one another, comprising:
(A) 5 to 95 wt % of at least one resin with nucleophilic groups the resin selected from the group consisting of polyamides, polyester imides, and polyesters,
(B) 1 to 70 wt % of at least one amide group-containing resin,
(C) 1 to 30 wt % of at least one polyurethane resin,
(D) 1 to 30 wt % of at least one epoxy resin,
(E) 5 to 95 wt % of at least one organic solvent,
wherein the resins of component (B) are the reaction product of 1-carboxy-2-oxocycloalkane or an alkyl or aryl ester thereof with an isocyanate under basic conditions, wherein the isocyanate is selected from the group consisting of propylene diisocyanate, trimethylene diisocyanate, tetramethylene diisocyanate, pentamethylene diisocyanate, hexamethylene diisocyanate, ethylethylene diisocyanate, 3,3,4-trimethyl hexamethylene diisocyanate, 1,3-cyclopentyl diisocyanate, 1,4-cyclohexyl diisocyanate, 1,2-cyclohexyl diisocyanate, 1,3-phenylene diisocyanate, 1,4-phenylene diisocyanate, 2,5-toluoylene diisocyanate, 2,6-toluoylene diisocyanate, 4,4′-biphenylene diisocyanate, 1,5-naphthylene diisocyanate, 1,4-naphthylene diisocyanate, 4,4′diphenylmethane diisocyanate, 2,4′-diphenylmethane diisocyanate, 4,4′dicyclohexylmethane diisocyanate, 2,4′-dicyclohexylmethane diisocyanate, isophorone diisocyanate, triisocyanatononane, and uretdiones or isocyanurates therefrom, and of further reaction with a polyester imide resin; and wherein, the percent by weight is based on the total selfbonding enamel.