Information sensing device with electroconductive structure and molded body surrounding each other
An information sensing device includes a substrate, one information sensing chip, one electroconductive structure and a molded body. An electrical output portion including output connections is formed on the substrate. The information sensing chip is electrically connected to the electrical output portion and has one bottom chip surface mounted on the substrate, and one top chip surface to be close to or in contact with an object to sense specific information of the object. The electroconductive structure is electrically connected to the electrical output portion. The molded body is in contact with the information sensing chip and the at least one electroconductive structure to expose the top chip surface and a first surface of the electroconductive structure. The top chip surface is disposed opposite the bottom chip surface. The top chip surface and the first surface are exposed outside and disposed on substantially the same plane.
1. An information sensing device, comprising:
a substrate, on which an electrical output portion comprising a plurality of output connections is formed, the electrical output portion being to be electrically connected to a circuit board;
one information sensing chip electrically connected to the electrical output portion of the substrate, wherein the information sensing chip has one bottom chip surface mounted on the substrate, and one top chip surface to be close to or in contact with an object to sense specific information of the object;
at least one electroconductive structure electrically connected to the electrical output portion of the substrate, wherein the at least one electroconductive structure comprises:
two horizontal plates disposed opposite each other and located at different levels with respect to the substrate; and
two connecting plates for connecting the two horizontal plates together; and
a molded body, which is in contact with the information sensing chip and the at least one electroconductive structure to expose the top chip surface of the information sensing chip and a first surface of the at least one electroconductive structure, wherein the top chip surface is disposed opposite the bottom chip surface, and the top chip surface and the first surface are exposed outside.
2. The device according to claim 1 , wherein an electrostatic charge approaching the information sensing device is conducted from the at least one electroconductive structure to the electrical output portion of the substrate.
3. The device according to claim 1 , wherein the molded body partially surrounds the information sensing chip and the at least one electroconductive structure, and the at least one electroconductive structure is mounted on the substrate.
4. The device according to claim 3 , wherein two side portions of the molded body are higher than a middle portion of the molded body, the top chip surface and the first surface.
5. The device according to claim 1 , wherein the at least one electroconductive structure partially surrounds the molded body and the substrate.
6. The device according to claim 1 , wherein the electroconductive structure can perform signal driving or sensing functions.
7. The device according to claim 1 , wherein the information sensing chip is a fingerprint sensing chip and the top chip surface of the fingerprint sensing chip is to be close to or in contact with a finger to sense a fingerprint of the finger.
8. The device according to claim 1 , wherein each of the connecting plates is angled.
9. The device according to claim 1 , wherein the at least one electroconductive structure and the information sensing chip have substantially the same height.
10. The device according to claim 1 , wherein the information sensing chip is disposed outside a portion of the molded body, which is surrounded by the electroconductive structure.
11. The device according to claim 1 , wherein the top chip surface and the first surface are disposed on substantially the same plane.
12. The device according to claim 1 , wherein the electroconductive structure further has a second surface disposed opposite the first surface, and the second surface of the electroconductive structure is mounted on the substrate.