Method of making multi-chip electronic package with reduced line skew
View Patent ↗A method of making an electronic package which includes a circuitized substrate having at least two electrical components positioned thereon. The package includes patterns of contact sites, each for having one of the components coupled thereto. The patterns of contact sites in turn are electrically interconnected by a grouping of conductive lines which, to substantially prevent skew, are of substantially the same length. The method involves forming the line patterns in such a manner so as to reduce line skew.
1. A method of making an electronic package, said method comprising:
providing first and second dielectric layers;
forming first and second conductive layers each including a plurality of conductive lines on said first and second dielectric layers, respectively, to form a circuitized substrate, said first conductive layer being further formed to include a first pattern of at least twenty electrical component contact sites and a plurality of second patterns each of at least twenty electrical component contact sites substantially surrounding said first pattern of at least twenty electrical component contact sites and spaced from said first pattern of at least twenty electrical component contact sites;
forming a first plurality of said conductive lines to interconnect selected ones of said contact sites of said first pattern of at least twenty electrical component contact sites with selected ones of said contact sites of said second patterns of electrical component contact sites such that selected ones of said first plurality of conductive lines include selected ones of said conductive lines of said first conductive layer and said conductive lines of said second conductive layer while selected ones of others of said first plurality of conductive lines are formed to include only conductive lines of said first conductive layer, said conductive lines of said second conductive layer being electrically coupled to said selected ones of said conductive lines of said first conductive layer, said selected ones of others of said first plurality of conductive lines interconnecting said selected ones of said contact sites of said first and second patterns being of substantially the same length; and
positioning a plurality of electrical components on said first conductive layer of said circuitized substrate, each of said plurality of electrical components being electrically coupled to a respective one of said first and second patterns of electrical component contact sites and therefore to one another by said selected ones of others of said first plurality of conductive lines interconnecting said selected ones of said contact sites of said first and second patterns and which are of said substantially the same length, and
electrically coupling each of said electrical components to a respective one of said patterns of electrical component contact sites and therefore to one another by said plurality of conductive lines of said substantially same length.
2. The method of claim 1 wherein said electrically coupling of said electrical components is achieved using a plurality of solder ball members.
3. The method of claim 1 wherein said conductive lines are formed using photolithographic processing.
4. The method of claim 1 further including forming a plurality of thru-holes within said circuitized substrate to provide said electrical coupling of said conductive lines of said second conductive layer to said conductive lines of said first conductive layer.