LED illumination device with layered phosphor pattern
A method of applying at least two phosphors to an LED, wherein a first phosphor material having a lower absorption, shorter luminescence decay time, and/or lower thermal quenching than a second phosphor material is positioned closer to the LED than the second phosphor. Such an arrangement provides a light emitting device with improved lumen output and color stability over a range of drive currents.
1. A method of forming a light emitting device comprising depositing a first phosphor material over a semiconductor light emitter and depositing a second phosphor material over said first phosphor material, such that said first phosphor material is closer to said semiconductor light emitter than said second phosphor material, wherein said first phosphor material has at least one of a shorter decay time and a lower absorption of radiation from said semiconductor light emitter than said second phosphor material.
2. A method according to claim 1 , wherein said semiconductor light emitter comprises a light emitting diode.
3. A method according to claim 2 , wherein said light emitting diode emits in the wavelength of from about 350 to 440 nm.
4. A method according to claim 1 , wherein said first phosphor material is disposed in a matrix material and applied to the LED as a layer.
5. A method according to claim 4 , wherein said matrix material is selected from silicone, epoxy and mixtures thereof.
6. A method according to claim 1 , further comprising one or more additional phosphor materials.
7. A method according to claim 1 , wherein said first phosphor material has at least one of a luminescence decay time of less than about 3 ms and a plaque absorption of less than about 60% at a mean particle size of 10 μm.
8. A method according to claim 1 , wherein said second phosphor material has at least one of a luminescence decay time of greater than about 10 ms and a plaque absorption of greater than about 80% at a mean particle size of 10 μm.
9. A method according to claim 1 , wherein said first phosphor material comprises Eu 2+ —Mn 2+ phosphors.
10. A method according to claim 1 , wherein said first phosphor material comprises (Sr,Ca,Ba,Mg,Zn) 2 P 2 O 7 :Eu 2+ , Mn 2+ ; Sr 4 Al 14 O 25 :Eu 2+ ; or blends thereof.
11. A method according to claim 1 , wherein said second phosphor material comprises (Ca,Sr,Ba,Mg) 10 (PO 4 ) 6 (F,Cl,Br,OH):Eu 2+ ,Mn 2+ .
12. A method according to claim 1 , wherein said first phosphor material comprises one or more of (Ba,Sr,Ca)Al 2 O 4 :Eu 2+ ; (Ba,Sr,Ca) 2 SiO 4 :Eu 2+ ; (Ba,Sr,Ca) 2 (Mg,Zn)Si 2 O 7 :Eu 2+ ; (Sr,Ca,Ba)(Al,Ga,In) 2 S 4 :Eu 2+ ; (Ca,Sr,Ba,Mg) 10 (PO 4 ) 6 (F,Cl,Br,OH):Eu 2+ ; (Ca,Sr) 8 (Mg,Zn)(SiO 4 ) 4 Cl 2 :Eu 2+ ; (Sr,Ca,Ba,Mg) 10 (PO 4 ) 6 (F,Cl,Br,OH):Eu 2+ ; (Ba,Sr,Ca)MgAl 10 O 17 :Eu 2+ ; (Sr,Ca) 10 (PO 4 ) 6 *nB 2 O 3 :Eu 2+ ; 2SrO*0.84P 2 O 5 *0.16B 2 O 3 :Eu 2+ ; Sr 2 Si 3 O 8 *2SrCl 2 :Eu 2+ ; Ba 3 MgSi 2 O 8 :Eu 2+ ; Sr 4 Al 14 O 25 :Eu 2+ ; BaAl 8 O 13 :Eu 2+ ; (Y,Gd,Th,La,Sm,Pr,Lu) 3 (Al,Ga) 5 O 12 :Ce 3+ ; and blends thereof.
13. A method according to claim 1 , wherein said second phosphor material comprises one or more of (Ba,Sr,Ca)MgAl 10 O 17 :Eu 2+ ,Mn 2+ ; (Sr,Ca,Ba,Mg,Zn) 2 P 2 O 7 :Eu 2+ , Mn 2+ ; (Ca,Sr,Ba,Mg) 10 (PO 4 ) 6 (F,Cl,Br,OH):Eu 2+ ,Mn 2+ ; (Ca,Sr) 8 (Mg,Zn)(SiO 4 ) 4 C 12 :Eu 2+ ,Mn 2+ ; (Ba,Sr,Ca)MgP 2 O 7 :Eu 2+ ,Mn 2+ ; 3.5MgO*0.5MgF 2 *GeO 2 :Mn 4+ ; (Ca,Sr,Ba,Mg) 10 (PO 4 ) 6 (F,Cl,Br,OH):Eu 2+ ,Mn 2+ ; (Ca,Sr) 8 (Mg,Zn)(SiO 4 ) 4 C 12 :Eu 2+ ,Mn 2+ ; and blends thereof.
14. A method of forming a light emitting device comprising depositing a first phosphor material over a semiconductor light emitter and depositing a second phosphor material over said first phosphor material, such that the first phosphor material is closer to said semiconductor light emitter than said second phosphor material, wherein said first phosphor material has reduced thermal quenching than said second phosphor material.
15. A method according to claim 14 , wherein said semiconductor light emitter comprises a light emitting diode.
16. A method according to claim 15 , wherein said light emitting diode emits in the wavelength of from about 350 to 440 nm.
17. A method according to claim 14 , wherein said first phosphor material is disposed in a matrix material and applied to the LED as a layer.
18. A method according to claim 17 , wherein said matrix material is selected from silicone, epoxy and mixtures thereof.
19. A method according to claim 14 , wherein said first and second phosphor materials comprise one or more of (Ba,Sr,Ca)Al 2 O 4 :Eu 2+ ; (Ba,Sr,Ca) 2 SiO 4 :Eu 2+ ; (Ba,Sr,Ca) 2 (Mg,Zn)Si 2 O 7 :Eu 2+ ; (Sr,Ca,Ba)(Al,Ga,In) 2 S 4 :Eu 2+ ; (Ca,Sr,Ba,Mg) 10 (PO 4 ) 6 (F,Cl,Br,OH)Eu 2+ ; (Ca,Sr) 8 (Mg,Zn)(SiO 4 ) 4 Cl 2 :Eu 2+ ; (Sr,Ca,Ba,Mg) 10 (PO 4 ) 6 (F,Cl,Br,OH):Eu 2+ ; (Ba,Sr,Ca)MgAl 10 O 17 :Eu 2+ ; (Sr,Ca) 10 (PO 4 ) 6 *nB 2 O 3 :Eu 2+ ; 2SrO*0.84P 2 O 5 *0.16B 2 O 3 :Eu 2+ ; Sr 2 Si 3 O 8 *2SrCl 2 :Eu 2+ ; Ba 3 MgSi 2 O 8 :Eu 2+ ; Sr 4 Al 14 O 25 :Eu 2+ ; BaAl 8 O 13 :Eu 2+ ; (Y,Gd,Th,La,Sm,Pr,Lu) 3 (Al,Ga) 5 O 12 :Ce 3+ ; (Ba,Sr,Ca)MgAl 10 O 17 :Eu 2+ ,Mn 2+ ; (Sr,Ca,Ba,Mg,Zn) 2 P 2 O 7 :Eu 2+ , Mn 2+ ; (Ca,Sr,Ba,Mg) 10 (PO 4 ) 6 (F,Cl,Br,OH):Eu 2+ ,Mn 2+ ; (Ca,Sr) 8 (Mg,Zn)(SiO 4 ) 4 C 12 :Eu 2+ ,Mn 2+ ; (Ba,Sr,Ca)MgP 2 O 7 :Eu 2+ Mn 2+ ; 3.5MgO*0.5MgF 2 *GeO 2 :Mn 4+ ; (Ca,Sr,Ba,Mg) 10 (PO 4 ) 6 (F,Cl,Br,OH):Eu 2+ ,Mn 2+ ; (Ca,Sr) 8 (Mg,Zn)(SiO 4 ) 4 C 12 :Eu 2+ ,Mn 2+ ; and blends thereof.
20. A method according to claim 14 , further wherein said first phosphor material has at least one of a shorter decay time and a lower absorption of radiation from said semiconductor light emitter than said second phosphor material.