Method for arranging print head chips

1. A method for arranging print head chips, comprising:

(a) setting a first fiducial mark and a second fiducial mark on a PCB for determining coordinate positions of a plurality of array units that are arranged on the PCB and calculating a print range of the array units, wherein each array unit has a plurality of spots that are transversely arranged from the first one of the spots to the last one of the spots in sequence;

(b) setting a third fiducial mark as a start point for arranging the first spot of a first array unit of the array units on the PCB; and

(c) arranging other array units on the PCB in sequence according to the coordinate positions and the start point.

2. The method as claimed in claim 1 , wherein each array unit has a substrate, and the spots of each array unit are arranged on the substrate.

3. The method as claimed in claim 1 , wherein an offset along an x-direction between the first spot of the first array unit of the array units and a last spot of a last array unit of the array units is about 211 μm±20 μm.

4. The method as claimed in claim 1 , wherein a maximum offset along a y-direction between the first spot of the first array unit of the array units and a last spot of a last array unit of the array units is 15 μm.

5. The method as claimed in claim 1 , wherein each array unit is an LED array chip, and each spot is an LED spot.

6. The method as claimed in claim 1 , wherein each array unit is an inkjet hole array chip, and each spot is an inkjet hole.

7. A print head manufactured according to the method of claim 1 being an LED print head (LPH).

8. A print head manufactured according to the method of claim 1 being an inkjet print head.