IP Library Patent Application 12010768
Patent Application
App. No. 12/010,768

Induction heated server and method of making

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Quick Facts
Patent No.
US None
App. No.
12/010,768
Abstract

An induction heatable server comprises a base element having a bottom wall and a peripheral wall defining an upwardly opening cavity in which are disposed a heat retentive disc and a ring member which is bonded to the peripheral wall. A top element extends over the ring member and seals the cavity. The top element is bonded to the peripheral wall of the base element and the ring member to preclude moisture penetration into the cavity.

Claims (20)

1 . An induction heatable server comprising:

(a) a synthetic resin top element having a depending peripheral flange;

(b) a synthetic resin bottom element having a bottom wall and a peripheral wall with an upper portion extending over the peripheral portion of said top element and together defining a cavity; and

(c) a heat retentive disc in said cavity, said bottom element being overmolded with synthetic resin about said heat retentive disc and having a generally horizontal flange extending over said peripheral portion of said top element to encapsulate said heat retentive disc and to firmly bond the elements into a monolithic structure which precludes moisture penetration into said cavity.

2 . The induction heatable server in accordance with claim 1 wherein there is included a ring member extending about the periphery of said heat retentive disc, said ring member being overmolded by resin and bonded to peripheral wall of said bottom element.

3 . The induction heatable server in accordance with claim 1 wherein there is included a layer of insulation in said cavity below said heat retentive disc.

4 . The induction heatable server in accordance with claim 2 wherein said ring member has a body portion and a depending leg portion with an inwardly extending flange at its lower end.

5 . The induction heatable server in accordance with claim 4 wherein said top element has a depending peripheral flange abutting the top and outer side surfaces of said ring member.

6 . The induction heatable server in accordance with claim 1 wherein there is included an RFID tag sealed in a well in the lower surface of said bottom wall.

7 . The induction heatable server in accordance with claim 3 wherein a polymer film is provided above the insulation to preclude flow of the overmolded resin into said insulation.

8 . The induction heatable server in accordance with claim 4 where said ring has an inwardly extending flange on which said insulation and heat retentive disc are seated.

9 . The induction heatable server in accordance with claim 1 wherein said top element has a generally vertical circumferential surface with closely spaced vertical ribs extending thereabout.

10 . In a method for making a heat retentive server, the steps comprising:

(a) molding a generally disc-shaped top element with a depending peripheral flange;

(b) seating in a mold cavity said top element and a heat retentive disc; and

(c) injecting molten resin into said mold cavity to flow about the outer periphery of said top element and said heat retentive disc to provide an outer shell with a bottom wall and a sidewall, the upper portion of said side wall having a flange portion overlying a peripheral portion of said top element.

11 . The method of making a heat retentive server in accordance with claim 10 where there is molded a ring member having an inwardly extending flange at its lower end and said seating step includes placing therein said ring member, said disc and said top element thereon.

12 . The method of making a heat retentive server in accordance with claim 10 wherein said seating step includes a layer of insulation.

13 . The method of making a heat retentive server in accordance with claim 10 wherein said injecting step produces a cavity in the bottom wall of said shell and wherein an RFID chip is sealed in said cavity.

14 . The method of making a heat retentive server in accordance with claim 10 wherein said seating step includes placing a polymeric film over said insulation to provide a barrier protecting said insulation from the flowing resin.

Assignments (5)
CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 026281 FRAME 0870. ASSIGNOR(S) HEREBY CONFIRMS THE CHANGE OF NAME. Recorded Oct 6, 2011
From: SEITZ CORPORATION
To: NEWSTAR BUSINESS CREDIT, LLC (F/K/A CORE BUSINESS CREDIT, LLC)
Reel/Frame 027027/0394 →
CHANGE OF NAME Recorded May 16, 2011
From: CORE BUSINESS CREDIT, LLC
To: NEWSTAR BUSINESS CREDIT, LLC
Reel/Frame 026281/0870 →
SECURITY AGREEMENT Recorded Sep 10, 2010
From: SEITZ CORPORATION
To: CORE BUSINESS CREDIT, LLC
Reel/Frame 024964/0220 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 29, 2008
From: BELAND, ALBERT J.; RUNYAN, RICHARD C.
To: DINEX INTERNATIONAL INC.
Reel/Frame 020475/0182 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 29, 2008
From: JONES, BRIAN C.; GOYETTE, GLENN H.
To: SEITZ CORPORATION
Reel/Frame 020477/0159 →