Composite mechanical transducers and approaches therefor

1. A mechanical transducer arrangement comprising:

a substrate;

a pair of composite structures, each structure including first and second materials arranged as a function of their respective TCE (temperature coefficient of Young's Modulus) values to set a turnover temperature (TOT) of the composite structure, the respective composite structures having first and second materials arranged as a function of their respective TCEs to set different TOTs, the second materials of the respective structures being of the same thickness; and

for each composite structure, an anchor configured to secure the composite structure to the substrate at a single location and configured to permit at least one other location thereof to remain nonanchored for mitigating coupling of stresses into the composite structure.

2. The arrangement of claim 1 , wherein the first and second materials of at least one of the composite structures are arranged to set a TCF (temperature coefficient of frequency) that is consistent over a temperature range including the TOT of the at least one of the composite structures.

3. The arrangement of claim 1 , wherein the first and second materials of at least one of the composite structures are arranged to set a frequency response that is about zero for temperatures in a temperature range including the TOT of the at least one of the composite structures.

4. The arrangement of claim 1 , wherein the first and second materials of at least one of the composite structures are arranged to set a consistent mechanical stiffness of the composite structure over a temperature range including the TOT of the at least one of the composite structures.

5. The arrangement of claim 1 , wherein the first and second materials of at least one of the composite structures are arranged to mitigate fluctuation in mechanical stiffness of the composite structure over a temperature range including the TOT of the at least one of the composite structures, relative to a fluctuation in mechanical stiffness of the first material over said temperature range.

6. The arrangement of claim 1 , wherein at least one of the composite structures exhibits a frequency change with respect to temperature having an absolute value that

approaches zero as the temperature of the structure approaches the TOT,

remains at about zero over a small temperature range that includes the TOT, and

increases beyond zero as the temperature of the structure increases beyond the TOT.

7. The arrangement of claim 1 , further including a temperature-controlling device to maintain the each of the composite structures at a temperature that is about equal to the TOT of the respective structures.

8. The arrangement of claim 1 , wherein at least one of the composite structures consists of the first and second materials.

9. A mechanical transducer arrangement comprising:

a substrate;

at least two composite structures, each structure including first and second materials arranged as a function of their respective TCE (temperature coefficient of Young's Modulus) values to set a selected turnover temperature (TOT) of the composite structure and to mitigate fluctuation in mechanical stiffness of the composite structure over a temperature range including the TOT, relative to a fluctuation in mechanical stiffness of the first material over said temperature range, the first materials of the respective composite structures being arranged differently to set different selected TOTs; and

an anchor configured to secure the composite structure to the substrate at a single location and configured to permit at least one other location thereof to remain nonanchored for mitigating coupling of stresses into the composite structure.

10. The arrangement of claim 9 , further including a heating element for at least one of the composite structures to heat the composite structure to a temperature that is about equal to the TOT.

11. The arrangement of claim 9 , further including an electrostatic circuit for at least one of the composite structures to apply an electrostatic charge to the composite structure to mitigate fluctuation in mechanical stiffness.

12. The arrangement of claim 9 , wherein at least one of the composite structures exhibits a TCF of a set value over an operating temperature range of the mechanical transducer.

13. The arrangement of claim 9 , wherein at least one of the composite structures consists of the first and second materials.

14. An encapsulated resonator arrangement comprising:

a substrate;

at least two a composite resonant structures, each structure extending over the substrate and including

a structural material susceptible to temperature-related fluctuation in resonant frequency, and

a compensation material grown on an outer surface of the structural material and having a TCE, shape and thickness, relative to the structural material and its shape, to set a selected turnover temperature (TOT) of the composite resonant structure and to passively mitigate the temperature-related fluctuation in resonant frequency in the composite resonant structure over a temperature range including the TOT, the compensation material for each composite resonant structure being of the same thickness and the TOT of each respective composite resonant structure being different;

a support structure configured to secure the composite resonant structure to the substrate at a single location and configured to permit at least one other location thereof to remain nonanchored for mitigating coupling of stresses into the composite structure;

sidewall material on the substrate and laterally adjacent the composite resonant structure; and

an encapsulation material over the composite resonant structure and, with the substrate and sidewall material, encapsulating the composite resonant structure.

15. The arrangement of claim 14 , wherein the structural and compensation materials of at least one of the composite resonant structures are arranged to set a TCF (temperature coefficient of frequency) of the composite resonant structure that is consistent over a temperature range including the TOT.

16. The arrangement of claim 14 , wherein the structural and compensation materials of at least one of the composite resonant structures are arranged to facilitate a consistent mechanical stiffness of the composite structure over a temperature range including the TOT.

17. The arrangement of claim 14 , further including a temperature control circuit to control the temperature of at least one of the composite resonant structures within a range of temperatures including the TOT of the structure.

18. An encapsulated resonator arrangement comprising:

a resonant structure comprising substantially parallel beams of structural and compensation materials each having a composition, shape and respective TCE, arranged relative to one another, to set a selected turnover temperature (TOT) of the resonant structure and to passively mitigate temperature-related fluctuation in resonant frequency over a temperature range including the TOT, the beams being fixed at one end and extending cantilevered to a free end;

a substrate underlying the resonant structure;

an anchor configured to secure the resonant structure to the underlying substrate at a single location and configured to permit the free end of the beams to remain nonanchored for mitigating coupling of stresses into the composite structure;

sidewalls including electrodes over the substrate and laterally adjacent to resonant structure;

an encapsulation layer over the resonant structure, the encapsulation layer, sidewalls and substrate encapsulating the resonant structure;

an electrical circuit to apply an electrostatic charge to the resonant structure via the sidewall electrodes; and

wherein the resonant structure responds to the electrostatic charge by resonating at a resonant frequency that is substantially consistent over an operational temperature range of the resonator arrangement, the temperature range including the TOT.

19. A method for manufacturing a mechanical transducer arrangement, the method comprising:

forming a pair of composite structures by

forming structural material over and anchored to a substrate at a single location and configured to permit at least one other location thereof to remain nonanchored for mitigating coupling of stresses into the composite structure, the structural material of the respective composite structures being different from one another and being susceptible to temperature-related fluctuation in mechanical stiffness, and

forming a compensation material coupled to the structural material,

for each composite structure, the compensation material and the structural material having respective TCE, shape and arrangement to set a selected turnover temperature (TOT) of the composite structure and to passively mitigate the temperature-related fluctuation in mechanical stiffness exhibited by the structural material, the TOTs of each composite structure being different; and

encapsulating the composite structure.

20. The method of claim 19 , wherein, for each composite structure, the steps of forming the structural and compensation materials include selecting the composition, shape and quantity of compensation material having a TCE that is opposite in sign from the TCE of the structural material, and arranging the compensation material in shape and quantity, relative to the structural material, to form the composite structure consisting of the structural material and the compensation material and that exhibits a selected TOT.

21. A mechanical transducer arrangement comprising:

a substrate;

a first composite structure having a pair of substantially parallel beams extending cantilevered over the substrate, the structure being anchored to the substrate at a single location to support a fixed end of the beams and configured to permit a free cantilevered end of the beams to remain nonanchored for mitigating coupling of stresses into the composite structure, and including at least two materials arranged as a function of their respective TCE (temperature coefficient of Young's Modulus) values to set a turnover temperature (TOT) of the composite structure; and

a second composite structure anchored to the substrate at a single location and including at least two materials arranged as a function of their respective TCE (temperature coefficient of Young's Modulus) values to set a turnover temperature (TOT) of the second composite structure that is different than the TOT of the first composite structure.

22. The arrangement of claim 21 , further including

a circuit to generate, for each of the composite structures, an electrical output indicative of the frequency of the structure, and

a circuit to use the outputs to generate a signal that is indicative of a temperature of the mechanical transducer arrangement.

23. The arrangement of claim 21 , wherein

the TOT of the first composite structure is in the middle of a particular temperature range, and

the second composite structure has a TCF that is at least about 10% larger than the TCF of the first composite structure, at temperatures in the particular temperature range.

24. A resonator arrangement comprising:

a substrate;

an elongated composite resonant structure including substantially parallel beams that extend cantilevered over the substrate from a fixed end to a free end, each of the beams including

a structural material susceptible to temperature-related fluctuation in resonant frequency, and

compensation material grown on an outer surface of the structural material and having a TCE and thickness, relative to the structural material, to passively mitigate the temperature-related fluctuation in resonant frequency in the composite resonant structure;

a support structure coupling the elongated composite resonant structure at the fixed end of the beams to the substrate at a single location to solely support the composite resonant structure, the free end of the beams extending away from the support structure and cantilevered over the substrate;

sidewall material on the substrate and laterally adjacent the composite resonant structure, and

an encapsulation material over the composite resonant structure and, with the substrate and sidewall material, encapsulating the composite resonant structure.

25. The arrangement of claim 24 , wherein the free ends of the beams extend unsupported over the substrate to resonate independently from one another.

26. The arrangement of claim 24 , further including an end piece that connects the free ends of the beams to one another.

27. A resonator arrangement comprising:

a substrate;

at least two elongated composite resonant structures respectively including substantially parallel beams that extend cantilevered over the substrate from a fixed end to a free end, each of the beams including

a structural material susceptible to temperature-related fluctuation in resonant frequency, the structural material of one of the composite resonant structures having a different shape than the structural material of another one of the composite resonant structures, and

compensation material grown on an outer surface of the structural material and having a TCE and thickness, relative to the structural material, to passively mitigate the temperature-related fluctuation in resonant frequency in the composite resonant structure over a temperature range that is different for said one of the composite resonant structures, relative to the other one of the composite resonant structures; and

a support structure coupling the elongated composite resonant structure at the fixed end of the beams to the substrate at a single location to solely support the composite resonant structure, the free end of the beams extending away from the support structure and cantilevered over the substrate.

28. The arrangement of claim 27 , wherein the free ends of the beams of at least one of the composite resonant structures extend unsupported over the substrate to resonate independently from one another.

29. The arrangement of claim 27 , further including an end piece that connects the free ends of the beams to one another of at least one of the composite resonant structures.

30. The arrangement of claim 27 , further including,

sidewall material on the substrate and laterally adjacent the composite resonant structures, and

an encapsulation material over the composite resonant structures and, with the substrate and sidewall material, encapsulating the composite resonant structures.