IP Library Granted Patent US 7,823,369
Granted Patent B2
US 7,823,369 · App. 12/018,089 · Granted Nov 2, 2010

Device for packaging an electronic component

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Quick Facts
Patent No.
US 7,823,369
App. No.
12/018,089
Granted
Nov 2, 2010
Kind
B2
Abstract

The invention relates to a method of packaging or a device for packaging an electronic component, such as semiconductor device, whereby the component is positioned in a cavity of a foil by tweezers and is supported by means of a further foil which is attached to the foil at one side thereof. According to an example embodiment, the component is first placed into the cavity of the foil by the tweezers, and only after that is the further foil positioned adjacent thereto and attached to the foil. The tweezers are moved through the foil to pick up the component, hold it, and move it into the cavity. A feature of this embodiment is that the component may be temporarily supported by a supporting means after being positioned in the cavity and before being attached to the further foil and the foil with the component is moved in a longitudinal direction of the foil.

Claims (12)

1. A device for packaging an electronic component, the device comprising:

a component holder to hold an electronic component;

a foil holder to hold a strip-shaped foil that has two major surfaces and an array of cavities, wherein the cavities are through holes in the strip-shaped foil that pass between the two major surfaces of the strip-shaped foil;

a further foil holder configured to provide a further foil against one major surface of the strip-shaped foil, which further foil supports or retains the electronic component after the further foil is attached to the strip-shaped foil; and;

tweezers by means of which the electronic component is taken from the component holder and placed in one of the cavities of the strip-shaped foil, wherein the tweezers move in a direction substantially perpendicular to the major surfaces of the strip-shaped foil;

wherein the tweezers and the further foil holder are positioned and constructed such that first the electronic component is placed in one of the cavities of the strip-shaped foil by the tweezers, and only then is the further foil attached to the strip-shaped foil;

characterized in that the tweezers comprise two needles, which are located at opposite sides of the strip-shaped foil during operation; and

characterized in that one of the two needles has an obtuse end and the other one a sharp end, while the needles are movable exclusively in a direction substantially perpendicular to the strip-shaped foil.

2. A device as claimed in claim 1 , characterized in that the device is provided with transport means for the strip-shaped foil and with supporting means for supporting the electronic component in one of the cavities of the strip-shaped foil before the further foil is provided.

3. A device as claimed in claim 2 , characterized in that the supporting means comprise a roller belt.

4. A device as claimed in claim 2 , characterized in that the supporting means comprises a furcate member which is displaced parallel to the strip-shaped foil.

5. A device as claimed in claim 1 , characterized in that the component holder for the electronic component comprises an elastic membrane on which an array of electronic components is present.

Assignments (11)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
PATENT RELEASE Recorded Aug 17, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 039707/0471 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
MERGER Recorded Jan 6, 2016
From: SEONG CAPITAL LTD. LIMITED LIABILITY COMPANY
To: XENOGENIC DEVELOPMENT LIMITED LIABILITY COMPANY
Reel/Frame 037421/0685 →