Patent Assignment
Reel/Frame 037421/0685
Merger
Recorded: 2016-01-06
Pages: 12
Assignor
SEONG CAPITAL LTD. LIMITED LIABILITY COMPANY
Executed: 2015-08-26
Assignee
XENOGENIC DEVELOPMENT LIMITED LIABILITY COMPANY
2711 CENTERVILLE RD, SUITE 400, WILMINGTON, DELAWARE, 19808
Covered Properties
(24)
Multiple Semiconductor Chip (Multi-Chip) Module for Use in High-Power Applications
Data Carrier with an Integrated Electronic Component and with a Transmission Coll Which Comprises Turn Portions Arranged Directly Against Said Component
Patent:
6,552,422 →
Application:
09/649,673 →
Semiconductor Device with Isolated Intermetal Dielectrics
Semiconductor Module Having Multiple Semiconductor Chips
Semiconductor Devices
Module Having a Lead Frame Equipped with Components on Both Sides
Chip-Mounted Contact Springs
Assembly with Connecting Structure
Junction Temperatures Measurements in Semiconductor Chip Package Technology
Multi-Chip Module Semiconductor Devices
Electrical or Electronic Component and Method of Producing Same
Method of and Device for Packaging Electronic Components Thus Packaged
Device for Forming Connection Elements
Wedge-Bonding of Wires in Electronic Device Manufacture with Reversible Wedge Bonding Tool
Semiconductor Device, Semiconductor Body and Method of Manufacturing Thereof
Electrical or Electronic Component and Method of Producing Same
Electronic Device Comprising an Integrated Circuit
Electronic Device Comprising an Integrated Circuit and a Capacitance Element
Device Comprising a Sensor Module
Device for Packaging an Electronic Component
Fine-Pitch Routing in a Lead Frame Based System-in-Package (Sip) Device
Redistribution Layer for Wafer-Level Chip Scale Package and Method Therefor
Method for Manufacturing an Electronic Assembly; an Electronic Assembly, a Cover and a Substrate
Electronic Device Comprising an Integrated Circuit and a Capacitance Element
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 3, 2020
From: XENOGENIC DEVELOPMENT LIMITED LIABILITY COMPANY
To: INTELLECTUAL VENTURES ASSETS 154 LLC
Reel/Frame 051413/0171 →
Assignment of Assignor's Interest
Jan 4, 2020
From: INTELLECTUAL VENTURES ASSETS 158 LLC
To: HANGER SOLUTIONS, LLC
Reel/Frame 051486/0425 →
Assignment of Assignor's Interest
Jan 27, 2020
From: INTELLECTUAL VENTURES ASSETS 154 LLC
To: LIBERTY PATENTS LLC
Reel/Frame 051709/0805 →
Assignment of Assignor's Interest
Feb 8, 2020
From: XENOGENIC DEVELOPMENT LIMITED LIABILITY COMPANY
To: INTELLECTUAL VENTURES ASSETS 158 LLC
Reel/Frame 051856/0484 →