Electrical or electronic component and method of producing same
View Patent ↗To refine an electrical or electronic component having at least one discrete or integrated device formed from a wafer, in plate or disk form, of semiconductive or insulating material, the front face of which device has at least one protruding electrode and is encapsulated by at least one front-face encapsulant, the side faces of which device are at least partly encapsulated by at least one side-face encapsulant, and the rear face of which device is encapsulated by at least one rear-face encapsulant, and to refine a method of producing the same, in such a way that, with the aim of widening the possible uses and applications, electrical contact is made not solely with the front face of the device that is to be housed in the plastics package of very small dimensions, it is proposed that both the side-face encapsulant and the rear-face encapsulant be formed at least partly of layers, but with the layers connected, of electrically conductive material.
1. An electrical or electronic component, having at least one discrete or integrated device formed from a substrate, the front face of said device has at least one protruding electrode and is encapsulated by at least one front-face encapsulant, the side faces of said device are at least partly encapsulated by at least one side-face encapsulant, and the rear face of which device is encapsulated by at least one rear-face encapsulant, wherein both the side-face encapsulant and the rear-face encapsulant are formed at least partly of layers, but with a connection between at least parts of layers, of electrically conductive material.
2. A component as recited in claim 1 , wherein the at least one protruding electrode which acts as a rear-face contact is arranged at the exposed end of the electrically conductive side-face encapsulant adjacent the front face of the device.
3. A component as recited in claim 1 , wherein the side-face encapsulant formed from electrically conductive material is encapsulated by side-face encapsulant formed from electrically insulating material and the rear-face encapsulant formed from electrically conductive material is encapsulated by rear-face encapsulant formed from electrically insulating material.
4. The component as recited in claim 1 , wherein the protruding electrode is ball-shaped or spherical.
5. The component as recited in claim 1 , wherein the substrate is selected from at least one of the following: semiconductor wafer, plate of insulating material, or disk of insulating material.