Patent Assignment
Reel/Frame 028049/0649
Assignment of Assignor's Interest
Recorded: 2012-04-16
Received: 2012-04-16
Pages: 12
Assignor
NXP B.V.
Executed: 2012-03-27
Assignee
SEONG CAPITAL LTD. LIMITED LIABILITY COMPANY
2711 CENTERVILLE RD, SUITE 400, WILMINGTON, DE, 19808, UNITED STATES
Covered Properties
(23)
Electronic Device Comprising an Integrated Circuit and a Capacitance Element
Application:
12/815,954 →
Redistribution Layer for Wafer-Level Chip Scale Package and Method Therefor
Application:
12/090,686 →
Device Comprising a Sensor Module
Application:
11/913,585 →
Method for Manufacturing an Electronic Assembly; an Electronic Assembly, a Cover and a Substrate
Application:
12/297,022 →
Fine-Pitch Routing in a Lead Frame Based System-in-Package (Sip) Device
Application:
12/088,713 →
Electronic Device Comprising an Integrated Circuit and a Capacitance Element
Application:
11/632,887 →
Device for Packaging an Electronic Component
Application:
12/018,089 →
Electronic Device Comprising an Integrated Circuit
Application:
11/632,518 →
Module Base Unit with Strain Relief Means
Application:
11/572,871 →
Electrical or Electronic Component and Method of Producing Same
Application:
11/351,746 →
Semiconductor Device, Semiconductor Body and Method of Manufacturing Thereof
Application:
10/548,297 →
Wedge-Bonding of Wires in Electronic Device Manufacture with Reversible Wedge Bonding Tool
Application:
10/525,594 →
Electrical or Electronic Component and Method of Producing Same
Application:
10/492,120 →
Device for Forming Connection Elements
Application:
10/504,752 →
Method of and Device for Packaging Electronic Components Thus Packaged
Application:
10/497,644 →
Multi-Chip Module Semiconductor Devices
Application:
10/301,200 →
Junction Temperatures Measurements in Semiconductor Chip Package Technology
Application:
10/282,450 →
Assembly with Connecting Structure
Application:
10/015,720 →
Chip-Mounted Contact Springs
Application:
10/005,689 →
Module Having a Lead Frame Equipped with Components on Both Sides
Application:
09/973,317 →
Semiconductor Devices
Application:
09/915,677 →
Semiconductor Module Having Multiple Semiconductor Chips
Application:
09/884,223 →
Semiconductor Device with Isolated Intermetal Dielectrics
Application:
09/829,797 →