Method for manufacturing an electronic assembly; an electronic assembly, a cover and a substrate
View Patent ↗The present invention relates to a method for manufacturing an electronic assembly ( 50 ) comprising an electronic component, a cavity and a substrate which method comprises; —providing an electronic component ( 10 ) having a first pattern with a substantially closed configuration; —providing a cover ( 18 ) on a surface of the electronic component, which cover together with said surface defines a cavity ( 20 ), the closed configuration of the first pattern substantially enclosing the cover at said surface; —providing a substrate ( 30 ) having a second pattern with a substantially closed configuration, which closed configuration at least partially corresponds to the closed configuration of the first pattern and comprises a solder pad; —disposing solder material at the solder pad; —positioning the electronic component and the substrate so as to align both the substantially closed configurations of the first and second pattern, while the substrate supports a top surface ( 28 ) of the cover; —reflow-soldering the solder material, therewith providing a soldered connection ( 52 ) between the first and second pattern. Furthermore the present invention relates to an electronic assembly ( 50 ), a cover ( 18 ) and a substrate ( 30 ).
1. A method for manufacturing an electronic assembly comprising an electronic component, a cavity and a substrate, which method comprises;
providing an electronic component having a first pattern with a substantially closed configuration;
providing a cover a surface of the electronic component, which cover together with said surface defines a cavity, the closed configuration of the first pattern substantially enclosing the cover at said surface;
providing a substrate having a second pattern with a substantially closed configuration, which closed configuration at least partially corresponds to the closed configuration of the first pattern and comprises a solder pad;
disposing solder material the solder pad;
positioning the electronic component and the substrate so as to align both the substantially closed configurations of the first and second pattern, while the substrate supports a top surface of the cover;
reflow-soldering the solder material, therewith providing a soldered connection between the first and second pattern.
2. A method as claimed in claim 1 , wherein the step of providing a cover on a surface of the electronic component comprises;
disposing a first layer on said surface, the first layer leaving an exposed area, the first layer substantially encloses said area;
disposing a second layer on the first layer, the second layer covering said area.
3. A method as claimed in claim 1 , wherein the steps of providing an electronic component and a substrate respectively comprise providing a first pattern having contact areas, which are electrically connected to electric contacts of the electronic component, and providing a second pattern having contact areas, which are electrically connected to electric contacts of the substrate, the contact areas of the first pattern corresponding to the contact area of the second pattern, and wherein solder material is also provided on the contact areas of the second pattern.
4. A method as claimed in claim 1 , wherein a cover having an air permeable wall surrounding the cavity is provided and prior to or during the step of reflow soldering at least the electronic component is brought in a protective environment or a vacuum environment.
5. An electronic assembly comprising;
an electronic component, a cover disposed on a surface of the electronic component, a cavity located between the surface and the cover, and a first pattern disposed on said surface, which first pattern has a substantially closed configuration and has contact areas connected to electric contacts of the electronic component, which closed configuration substantially encloses the cover at said surface;
a substrate, which supports a top surface of the cover and comprises a second pattern disposed on a surface of the substrate, which second pattern has a substantially closed configuration and has contact areas electrically connected to electric contacts of the substrate, which closed configuration at least partially corresponds to the closed configuration of the first pattern and comprises a solder pad;
a soldered connection between the first and second pattern.
6. An electronic assembly as claimed in claim 5 , wherein the soldered connection between the substantially closed configurations of respectively the first pattern and the second pattern provides an electrical function, such as a grounding function.
7. An electronic assembly as claimed in claim 5 , wherein the electronic component comprises a MEMS element accommodated in the cavity.
8. An electronic assembly as claimed in claim 5 , wherein the substrate comprises additional electronic components.
9. A cover to be used for an electronic assembly as claimed in claim 5 .
10. A substrate to be used for an electronic assembly as claimed in claim 5 , wherein the substrate comprises a second pattern having a substantially closed configuration, which pattern comprises a solder pad connected to the substantially closed configuration and contact areas electrically connected to electric contacts of the substrate, and the substrate comprises an amount of solder material disposed on the solder pad and the contact areas.