IP Library › Granted Patent US 7,847,469
Granted Patent B2
US 7,847,469 · App. 12/018,109 · Granted Dec 7, 2010

Micro-cantilever

Assignee: Taiyo Yuden Co., Ltd.
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Quick Facts
Patent No.
US 7,847,469
App. No.
12/018,109
Granted
Dec 7, 2010
Kind
B2
Abstract

A micro-cantilever of a simple structure and capable of obtaining a larger displacement at a low voltage including a plate-like piezoelectric substrate having electrode films as an upper electrode and a lower electrode formed on both surfaces thereof, a plate-like resilient member in close contact with the piezoelectric substrate on the side of the lower electrode and a support for supporting a driving member in a cantilever manner, in which a thin-walled portion is formed to the vicinity of a base portion of the driving member supported by the support.

Claims (12)

1. A micro-cantilever comprising:

a substantially rectangular plate-like piezoelectric substrate having an upper electrode formed substantially over the entire surface on one surface and a lower electrode formed substantially over the entire surface on the other surface thereof;

a plate-like resilient member in close contact with the surface of the piezoelectric substrate formed with the lower electrode so as to be structurally integral therewith; and

a support configured to support, in the cantilever manner, the vicinity at one end in the longitudinal direction of a driving member formed by close contact of the piezoelectric substrate and the resilient member, wherein a thin-walled portion having a thickness less than that of other portions of the driving member is formed to the vicinity of a base portion of the driving member supported by the support.

2. The micro-cantilever according to claim 1 , wherein the thin-walled portion is a portion where the thickness of the resilient member is decreased.

3. The micro-cantilever according to claim 1 , wherein the thin-walled portion is a portion where a portion of the upper electrode is slit-like or notch-like shape.

4. A cantilever comprising:

a piezoelectrically movable member attached to a support member in a cantilever manner, the movable member comprising a fixed segment supported by the support member and an unfixed segment movable with respect to the support member, wherein at least a portion of the unfixed segment proximal to the support member is substantially thinner than a portion of the unfixed segment distal from the support member.

5. The cantilever according to claim 4 , wherein the thinner portion is about 10% to 80% of the distal portion thickness.

6. The cantilever according to claim 4 , wherein the unfixed segment is configured to bend toward or away from the support member when a voltage is applied across the movable member.

7. A method of making a cantilever, the method comprising:

forming a piezoelectrically movable member attached to a support member in a cantilever manner, the movable member comprising a fixed segment supported by the support member and an unfixed segment movable with respect to the support member, wherein at least a portion of the unfixed segment proximal to the support member is substantially thinner than a portion of the unfixed segment distal from the support member.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 20, 2008
From: NAKAMURA, KENTARO; KONDOU, RYUICHI
To: TAIYO YUDEN CO., LTD.
Reel/Frame 021708/0160 →
Priority Claims (1)
JP 2007-018810 · Jan 30, 2007 · national
Continuity (1)
Related Publication 20090026892A1 · Jan 29, 2009