IP Library Granted Patent US 7,932,525
Granted Patent B2
US 7,932,525 · App. 12/020,401 · Granted Apr 26, 2011

Semiconductor light-emitting device

Assignees: Iwatani Corporation; Iwatani Electronics Corporation
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Quick Facts
Patent No.
US 7,932,525
App. No.
12/020,401
Granted
Apr 26, 2011
Kind
B2
Abstract

A semiconductor light-emitting device includes: a light-emitting semiconductor element arranged on a lead frame; a transparent resin mold covering the light-emitting semiconductor element and the lead frame except a terminal portion of the lead frame; and a reflective surface formed on a bent portion of part of the lead frame. The terminal portion of the lead frame has a terminal structure, which can serve as a combination of a top-view type and a side-view type.

Claims (13)

1. A semiconductor light-emitting device, comprising:

a light-emitting semiconductor element formed in a rectangular shape having long and short sides in a plan view;

a first reflective surface formed by bending both ends of a lead frame in a longitudinal direction diagonally upward;

a second reflective surface formed by bending both ends of the lead frame in a widthwise direction diagonally upward, the second reflective surface being adjacent to and facing to both surfaces of said light-emitting semiconductor element in the longitudinal direction;

a storage portion formed on the lead frame to place and hold thereon said light-emitting semiconductor element such that the longitudinal direction thereof extends along the longitudinal direction of the lead frame, said storage portion being surrounded by said first and second reflective surfaces;

a terminal portion formed by bending both ends of the lead frame in the longitudinal direction to be parallel with said storage portion, the terminal portion having a terminal structure and serving as a combination of a top-view type and a side-view type;

a transparent resin mold covering said light-emitting semiconductor element and the lead frame, except said terminal portion of the lead frame.

2. The semiconductor light-emitting device according to claim 1 , wherein said terminal portion of said lead frame is L-shaped in a plan view.

3. The semiconductor light-emitting device according to claim 1 , further comprising:

a protective diode arranged in a depressed portion of said lead frame, wherein an upper surface of said protective diode is located below an arrangement plane of said lead frame on which said light-emitting semiconductor element is arranged.

4. The semiconductor light-emitting device according to claim 3 , wherein an electrode on the upper surface of said protective diode is formed on the whole surface except a marginal region for securing pressure resistance of said protective diode.

5. The semiconductor light-emitting device according to claim 1 , wherein three light-emitting semiconductor elements, respectively, for red light emission, green light emission, and blue light emission are arranged on said lead frame.

6. The semiconductor light-emitting device according to claim 1 , wherein a light-emitting semiconductor element for monochromatic light emission is placed on said lead frame, and said light-emitting semiconductor element for monochromatic light emission is covered with a fluorescent layer.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 11, 2013
From: IWATANI CORPORATION; IWATANI ELECTRONICS CORPORATION
To: ACCELERATE DEVICE CORPORATION
Reel/Frame 029961/0571 →
CHANGE OF NAME Recorded Mar 18, 2011
From: IWATANI INTERNATIONAL CORPORATION
To: IWATANI CORPORATION
Reel/Frame 026002/0854 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 28, 2008
From: OSAMU, ABE
To: IWATANI INTERNATIONAL CORPORATION AND IWATANI ELECTRONICS CORPORATION
Reel/Frame 020428/0231 →
Priority Claims (1)
JP P2007-141420 · May 29, 2007 · national
Continuity (1)
Related Publication 20080296592A1 · Dec 4, 2008