High bandwidth cache-to-processing unit communication in a multiple processor/cache system
View Patent ↗A processor/cache assembly has a processor die coupled to a cache die. The processor die has a plurality of processor units arranged in an array. There is a plurality of processor sets of contact pads on the processor units, one processor set for each processor unit. Similarly, the cache die has a plurality of cache units arranged in an array. There is a plurality of cache sets of contact pads on the cache die, one cache set for each cache unit. Each cache set is in contact with one corresponding processor set.
1. A processor/cache assembly, comprising:
a first semiconductor die having an array of processing units, wherein:
each processing unit of the array of processing units has a set of processor contact pads;
the set of processor contact pads are conductive pads on a surface of the first semiconductor die;
each set of processor contact pads is unique from the set of processor contact pads of all other processing units of the array of processing units; and
each set of the processor contact pads includes a first subset of processor contact pads for address signals and a second subset of processor contact pads for data signals; and
a second semiconductor die having an array of cache units, wherein:
each cache unit of the array of cache units has a set of cache contact pads;
the set of cache contact pads are conductive pads on a surface external of the second semiconductor die;
each set of cache contact pads is unique from the set of cache contact pads of all other cache units of the array of cache units;
each set of the external contact pads includes a first subset of cache contact pads for address signals and a second subset of cache contact pads for data signals;
the first subset of cache contact pads of each cache unit is connected to the first subset of processor contact pads of a unique one of the processor units; and
the second subset of cache contact pads of each cache unit is connected to the second subset of processor contact pads of the processor unit to which its first subset of cache contact pads is connected.
2. The processor/cache assembly of claim 1 , wherein:
the first semiconductor die has a major surface;
the processor contact pads are on the major surface of the first semiconductor die;
the second semiconductor die has a major surface;
the cache contact pads are on the major surface of the second semiconductor die; and
the major surface of the first semiconductor die faces the major surface of the second semiconductor die.
3. The processor/cache assembly of claim 2 , wherein the processor contact pads are directly connected to the cache contact pads through conductive bumps.
4. The processor/cache assembly of claim 3 , wherein the first semiconductor die is further characterized as having a greater surface area than the second semiconductor die.
5. The processor/cache assembly of claim 4 , wherein the first semiconductor die has external contact pads along a periphery of the first semiconductor die for making external connections from the first semiconductor die.
6. The processor/cache assembly of claim 2 , further comprising an interposer between each major surface of the first semiconductor die and the second semiconductor die for connecting the processor contact pads to the cache contact pads.
7. The processor/cache assembly of claim 6 , wherein the interposer has traces for carrying power to at least one of a group consisting of the first semiconductor die and the second semiconductor die.
8. The processor/cache assembly of claim 7 , wherein the interposer extends beyond an outer boundary of the first semiconductor die and the second semiconductor die.
9. The processor/cache assembly of claim 1 , wherein the processing units have a first area and the cache units have a second area, wherein the first area and the second area are substantially the same.
10. The processor/cache assembly of claim 9 , wherein outer boundaries of the processing units and the cache units are coterminous.
11. The processor/cache assembly of claim 1 , wherein each of the processing units is the same shape and size as all other processing units.
12. The processor/cache assembly of claim 1 , wherein the array of processing units has a first geometric shape and the array of cache units has a second geometric shape that is a mirror image of the first geometric shape.
13. A processor/cache assembly, comprising:
a processor die having first, second, third, and fourth processor units arranged in an array of processor units;
first, second, third, and fourth sets of processor contact pads on a first major surface of the processor die, wherein the first, second, third, and fourth sets of processor contact pads are for carrying addresses from the first, second, third, and fourth processor units, respectively;
a cache die having first, second, third, and fourth cache units arranged in an array of cache units;
first, second, third, and fourth sets of cache contact pads on a first major surface of the cache die, wherein the first, second, third, and fourth sets of cache contact pads are for receiving addresses from the first, second, third, and fourth processor units, respectively, for the use of the first, second, third, and fourth cache units, respectively.
14. The processor/cache assembly of claim 13 , further comprising:
fifth, sixth, seventh, and eighth sets of processor contact pads on the first major surface of the processor die, wherein the fifth, sixth, seventh, and eighth sets of processor contact pads are for carrying data to and from the first, second, third, and fourth processor units, respectively; and
fifth, sixth, seventh, and eighth sets of cache contact pads on the first major surface of the cache die, wherein the fifth, sixth, seventh, and eighth sets of cache contact pads are for carrying data to and from the first, second, third, and fourth cache units, respectively.
15. The processor/cache assembly of claim 13 , wherein the first, second, third, and fourth cache units are caches dedicated to use by the first, second, third, and fourth processor units, respectively.
16. A processor/cache assembly, comprising:
a first semiconductor die having an array of processing units, wherein:
each processing unit of the array of processing units has a set of processor contact pads;
the set of processor contact pads are conductive pads on a surface of the first semiconductor die;
each set of processor contact pads is unique from the set of processor contact pads of all other processing units of the array of processing units; and
each set of the processor contact pads includes a first subset of processor contact pads for address signals and a second subset of processor contact pads for data signals;
a second semiconductor die having an array of cache units, wherein:
each cache unit of the array of cache units has a set of cache contact pads;
the set of cache contact pads are conductive pads on a surface external of the second semiconductor die;
each set of cache contact pads is unique from the set of cache contact pads of all other cache units of the array of cache units;
each set of the external contact pads includes a first subset of cache contact pads for address signals and a second subset of cache contact pads for data signals;
the first subset of cache contact pads of each cache unit is connected to the first subset of processor contact pads of a unique one of the processor units; and
the second subset of cache contact pads of each cache unit is connected to the second subset of processor contact pads of the processor unit to which its first subset of cache contact pads is connected; and
an interposer between adjoining surfaces of the first die and the second die for connecting processor contact pads of at least one processing unit of the array of processing units to correlated cache contact pads of a correlated cache unit of the array of cache units.
17. The processor/cache assembly of claim 16 , wherein the interposer has traces for carrying power to at least one of a group consisting of the first semiconductor die and the second semiconductor die.
18. The processor/cache assembly of claim 17 , wherein the interposer extends beyond an outer boundary of the first semiconductor die and the second semiconductor die.
19. The processor/cache assembly of claim 16 , wherein the processing units have a first area and the cache units have a second area, wherein the first area and the second area are substantially the same.
20. The processor/cache assembly of claim 16 , wherein the array of processing units has a first geometric shape and the array of cache units has a second geometric shape that is a minor image of the first geometric shape.