Hot melt application system
View Patent ↗Hot melt adhesive pellets are melted and pressure pumped in a controlled application pattern on the substrate at the application site. The high frequency power supply, induction heated melting susceptor, pressure pump, and pattern control electronics are all contained in a single unit within adhesive projection distance.
1. A method for melting and delivering thermoplastic material including the steps of:
melting material that contacts the surface of and passes through a magnetically heated susceptor;
pressurizing the melted material in an adjacent pump, having pump elements that are simultaneously heated by the same magnetic field; and
delivering the melted material to a target substrate by projection through a pump housing included orifice.
2. A method according to claim 1 where the pump rotor is reversed slightly at the end of each pump rotating cycle to draw back material in the projection orifice to break the projecting stream.
3. A method according to claim 1 that delivers a defined pattern of melted material to a targeted substrate by controlling the duration of the rotation of the pump elements.
4. A method according to claim 1 that controls the quantity of projected material by signaling the pump's motor controller to rotate an angle that will displace an equivalent volume.
5. A method according to claim 1 that supplies multiple orifices directed at the target substrate.