Semiconductor device having a semiconductor chip mounted on an insulator film and coupled with a wiring layer, and method for manufacturing the same
View Patent ↗A semiconductor device includes a first insulator film having a first opening, a first wiring layer extending from the first opening onto the first insulator film, a first semiconductor chip mounted on the first insulator film so as to be electrically coupled with the first wiring layer, and a resin portion applied on the first insulation film to cover the first semiconductor chip.
1. A semiconductor device comprising:
a first insulator film having a first opening and a first surface;
a first wiring layer comprising first portions that extend from the first opening onto the first surface of the first insulator film in first and second directions and a second portion, situated between the first portions, that comprises a first surface that is coplanar with the first surface of the first insulator film onto which the first portions extend and a second surface that is coplanar with a second surface of the first insulator film wherein the first surface of the first insulator film and the second surface of the first insulator film are single leveled;
a first semiconductor chip mounted on the first insulator film and electrically coupled with the first wiring layer;
a resin portion applied onto the first insulator film and adjacent to the sides of the semiconductor chip and adjacent to the surface of the semiconductor chip that faces away from the first insulator film and the first wiring layer;
a second insulator film having a second opening applied onto the resin portion; and
a second wiring layer extending between the second insulator film and the resin portion, wherein the resin portion fills the volume between the semiconductor chip and the second insulator film, between the semiconductor chip and the second wiring layer, between the first insulator film and the second insulator film, and between the first wiring layer and the second wiring layer.
2. The semiconductor device of claim 1 , further comprising a bonding wire for connecting the first semiconductor chip and the first wiring layer.
3. The semiconductor device according to claim 1 , further comprising a second semiconductor chip disposed below the second insulator film so as to be electrically coupled with the second wiring layer, wherein the resin portion covers the second semiconductor chip.
4. The semiconductor device according to claim 1 , further comprising a through electrode for connecting the first and the second wiring layers.
5. The semiconductor device according to claim 1 , wherein a thickness of the first wiring layer in the first opening is equal to a thickness of the first wiring layer on the first insulating film.
6. The semiconductor device according to claim 3 , wherein said first semiconductor chip and said second semiconductor chip are stacked.
7. The semiconductor devices according to claim 3 , wherein said first semiconductor chip and said second semiconductor chip are mounted to have facing top surfaces.
8. The semiconductor device according to claim 1 , further comprising a second semiconductor chip that is mounted on a leadframe.
9. The semiconductor device according to claim 1 wherein said first semiconductor chip is flip-chip mounted.