IP Library Granted Patent US 7,804,141
Granted Patent B2
US 7,804,141 · App. 12/033,017 · Granted Sep 28, 2010

Semiconductor element structure and method for making the same

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Quick Facts
Patent No.
US 7,804,141
App. No.
12/033,017
Granted
Sep 28, 2010
Kind
B2
Abstract

A semiconductor element structure includes a first MOS having a first high-K material and a first metal for use in a first gate, a second MOS having a second high-K material and a second metal for use in a second gate and a bridge channel disposed in a recess connecting the first gate and the second gate for electrically connecting the first gate and the second gate, wherein the bridge channel is embedded in at least one of the first gate and the second gate.

Claims (11)

1. A semiconductor element structure, comprising:

a first MOS having a first high-K material and a first metal for use in a first gate;

a second MOS having a second high-K material and a second metal for use in a second gate; and

a bridge channel, disposed in a recess connecting said first gate and said second gate for electrically connecting said first gate and said second gate, wherein said bridge channel is embedded in at least one of said first metal and said second metal.

2. The semiconductor element structure of claim 1 , wherein said first metal comprises a P-type metal and said second metal comprises an N-type metal.

3. The semiconductor element structure of claim 2 , wherein said P-type metal has a work function of 4.9 eV-5.1 eV.

4. The semiconductor element structure of claim 2 , wherein said N-type metal has a work function of 4.0 eV-4.2 eV.

5. The semiconductor element structure of claim 1 , wherein said first gate is adjacent to said second gate and part of said first high-K material and part of said second high-K material are sandwiched between said first metal and said second metal.

6. The semiconductor element structure of claim 1 , wherein said bridge channel partially occupies said first metal and said second metal.

7. The semiconductor element structure of claim 1 , wherein said bridge channel comprises a metal.

8. The semiconductor element structure of claim 1 , wherein said metal is selected from a group consisting of Al and W.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 26, 2021
From: UNITED MICROELECTRONICS CORPORATION
To: MARLIN SEMICONDUCTOR LIMITED
Reel/Frame 056991/0292 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 19, 2008
From: CHIANG, TIAN-FU; CHENG, LI-WEI; HSU, CHE-HUA; YU, CHIH-HAO; CHOU, CHENG-HSIEN; LAI, CHIEN-MING; CHEN, YI-WEN; LIN, CHIEN-TING; MA, GUANG-HWA
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 020522/0970 →