Positive type photosensitive resin composition
A positive type photosensitive resin composition for forming patterned resin film is provided. The patterned resin film has high transparency, low dielectric constant, high solvent resistance, high water resistance, high acid resistance, high alkali resistance, high heat resistance, and excellent adhesive properties with the substrate, which is obtained by developing with an alkali solution. The positive type photosensitive resin composition contains copolymer of compound of formula (I) and 1,2-quinonediazido compound, or further mixes with other alkali-soluble polymers, in formula (I), R 1 is hydrogen or alkyl group having 1-5 carbon atoms in which any hydrogen may be replaced by fluorine; and R 2 , R 3 and R 4 are independently hydroxyl group, alkyl group having 1-5 carbon atoms, alkoxyl group having 1-5 carbon atoms or —O(Si(C l H 2l+1 ) 2 O) m Si(C p H 2p+1 ) 3 , 1 is an integer of 1-5, m is 0 or an integer of 1-10, n is an integer of 1-5, and p is an integer of 1-5.
1. A positive type photosensitive resin composition, comprising a copolymer (A) and a 1,2-quinonediazido compound (B), wherein the copolymer (A) is obtained by polymerizing free radical polymerizable monomers (a1) of general formula (I) with other free radical polymerizable monomers (a2):
wherein R 1 is hydrogen or an alkyl group having 1-5 carbon atoms in which any hydrogen may be replaced by fluorine, and R 2 , R 3 , and R 4 are independently hydroxyl group, an alkyl group having 1-5 carbon atoms, an alkoxyl group having 1-5 carbon atoms or —O(Si(C l H 2l+1 ) 2 O) m Si(C p H 2p+1 ) 3 , wherein 1 is an integer of 1-5, m is 0 or an integer of 1-10, n is an integer of 1-5, and p is an integer of 1-5; and
wherein the other free radical polymerizable monomers (a2) are selected from free radical polymerizable monomers having phenolic OH of a general formula (II):
wherein in the general formula (II), R 5 , R 6 , and R 7 are independently hydrogen or an alkyl group having 1-3 carbon atoms in which any hydrogen may be replaced by fluorine, R 8 , R 9 , R 10 , R 11 , and R 12 are independently hydrogen, halogen, —CN, —CF 3 , —OCF 3 , —OH, an alkyl group having 1-5 carbon atoms in which any —CH 2 — may be replaced by —COO—, —OCO—, —CO— or any hydrogen may be replaced by halogen, or an alkoxyl group having 1-5 carbon atoms in which any hydrogen may be replaced by halogen, wherein at least one of R 8 , R 9 , R 10 , R 11 , and R 12 is —OH.
2. The positive type photosensitive resin composition according to claim 1 , further comprising an alkali-soluble copolymer (C), wherein the alkali-soluble copolymer (C) is obtained by polymerizing at least one of free radical polymerizable monomers having unsaturated carboxylic acid, free radical polymerizable monomers having unsaturated carboxylic anhydride, and free radical polymerizable monomers having phenolic OH.
3. The positive type photosensitive resin composition according to claim 1 , wherein the other free radical polymerizable monomers (a2) further comprise at least one of free radical polymerizable monomers having epoxy group.
4. The positive type photosensitive resin composition according to claim 2 , wherein the other free radical polymerizable monomers (a2) further comprise at least one of free radical polymerizable monomers having epoxy group.
5. The positive type photosensitive resin composition according to claim 1 , wherein the other free radical polymerizable monomers (a2) further comprises at least one of free radical polymerizable monomers having unsaturated carboxylic acid, free radical polymerizable monomers having unsaturated carboxylic anhydride.
6. The positive type photosensitive resin composition according to claim 2 , wherein the other free radical polymerizable monomers (a2) further comprises at least one of free radical polymerizable monomers having unsaturated carboxylic acid, free radical polymerizable monomers having unsaturated carboxylic anhydride.
7. The positive type photosensitive resin composition according to claim 2 , wherein the alkali-soluble copolymer (C) is obtained by polymerizing free radical polymerizable monomers having phenolic OH of the general formula (II):
wherein in the general formula (II), R 5 , R 6 , and R 7 are independently hydrogen or an alkyl group having 1-3 carbon atoms in which any hydrogen may be replaced by fluorine, R 8 , R 9 , R 10 , R 11 , and R 12 are independently hydrogen, halogen, —CN, —CF 3 , —OCF 3 , —OH, an alkyl group having 1-5 carbon atoms in which any —CH 2 — may be replaced by —COO—, —OCO—, —CO— or any hydrogen may be replaced by halogen, or an alkoxyl group having 1-5 carbon atoms in which any hydrogen may be replaced by halogen, wherein at least one of R 8 , R 9 , R 10 , R 11 , and R 12 is —OH.
8. The positive type photosensitive resin composition according to claims 6 , wherein the alkali-soluble copolymer (C) is obtained by polymerizing free radical polymerizable monomers having phenolic OH of the general formula (II):
wherein in the general formula (II), R 5 , R 6 , and R 7 are independently hydrogen or an alkyl group having 1-3 carbon atoms in which any hydrogen may be replaced by fluorine, R 8 , R 9 , R 10 , R 11 , and R 12 are independently hydrogen, halogen, —CN, —CF 3 , —OCF 3 , —OH, an alkyl group having 1-5 carbon atoms in which any —CH 2 — may be replaced by —COO—, —OCO—, —CO— or any hydrogen may be replaced by halogen, or an alkoxyl group having 1-5 carbon atoms in which any hydrogen may be replaced by halogen, wherein at least one of R 8 , R 9 , R 10, R 11 , and R 12 is —OH.
9. The positive type photosensitive resin composition according to claim 2 , wherein the alkali-soluble copolymer (C) is obtained by polymerizing free radical polymerizable monomers of the general formula (I):
wherein R 1 is hydrogen or an alkyl group having 1-5 carbon atoms in which any hydrogen may be replaced by fluorine, and R 2 , R 3 , and R 4 are independently hydroxyl group, an alkyl group having 1-5 carbon atoms, an alkoxyl group having 1-5 carbon atoms or —O(Si(C l H 2l+1 ) 2 O) m Si(C p H 2p+1 ) 3 , wherein 1 is an integer of 1-5, m is 0 or an integer of 1-10, n is an integer of 1-5, and p is an integer of 1-5.
10. The positive type photosensitive resin composition according to claim 1 , wherein the free radical polymerizable monomers (a1) comprise at least one of 3-methacryloxypropyltrimethoxysilane and methacryloxypropyl-tris-trimethylsiloxysilane.
11. The positive type photosensitive resin composition according to claim 2 , wherein the free radical polymerizable monomers (a1) comprise at least one of 3-methacryloxypropyltrimethoxysilane and methacryloxypropyl-tris-trimethylsiloxysilane.
12. The positive type photosensitive resin composition according to claim 3 , wherein the free radical polymerizable monomers having epoxy group comprises at least one of glycidyl (meth)acrylate, methylglycidyl (meth)aclylate, 3,4-epoxycyclohexylmethyl (meth)acrylate, 3-methyl-3-(meth)acryloxymethyloxetane, 3-ethyl-3-(meth)acryloxymethyloxetane, 3-methyl-3-(meth)acryloxyethyloxetane, and 3-ethyl-3-(meth)acryloxyethyloxetane.
13. The positive type photosensitive resin composition according to claim 4 , wherein the free radical polymerizable monomers having epoxy group comprises at least one of glycidyl (meth)acrylate, methylglycidyl (meth)acrylate, 3,4-epoxycyclohexylmethyl(meth)acrylate, 3-methyl-3-(meth)acryloxymethyloxetane, 3-ethyl-3-(meth)acryloxymethyloxetane, 3-methyl-3-(meth)acryloxyethyloxetane, and 3-ethyl-3-(meth)acryloxyethyloxetane.
14. The positive type photosensitive resin composition according to claim 1 , wherein the other free radical polymerizable monomers (a2)further comprise at least one of (meth)acrylic acid, maleic anhydride, hydroxystyrene, and 4-hydroxyphenyl vinyl ketone.
15. The positive type photosensitive resin composition according to claim 2 , wherein the other free radical polymerizable monomers (a2) further comprise at least one of (meth)acrylic acid, maleic anhydride, hydroxystyrene, and 4-hydroxyphenyl vinyl ketone.
16. The positive type photosensitive resin composition according to claim 2 , wherein the alkali-soluble copolymer (C) is obtained by polymerizing one or more free radical polymerizable monomers selected from (meth)acrylic acid, maleic anhydride, hydroxystyrene, and 4-hydroxyphenyl vinyl ketone.
17. The positive type photosensitive resin composition according to claim 2 , wherein the alkali-soluble copolymer (C) comprises at least one of free radical polymerizable monomers having N-substituted maleimide and free radical polymerizable monomers having dicyclopentanyl group.
18. The positive type photosensitive resin composition according to claim 17 , wherein N-substituted maleimide comprises at least one of N-methyl maleimide, N-ethyl maleimide, N-butyl maleimide, N-cyclohexyl maleimide, N-benzyl maleimide, N-phenyl maleimide, N-(4-acetylphenyl) maleimide, N-(2,6-diethylphenyl) maleimide, N-(4-dimethylamino-3,5-dinitrophenyl) maleimide, N-(1-anilinonaphthyl-4) maleimide, N-[4-(2-benzoxazolyl)phenyl] maleimide, and N-(9-acridinyl) maleimide.
19. The positive type photosensitive resin composition according to claim 17 , wherein the free radical polymerizable monomers having dicyclopentanyl group are dicyclopentanyl (meth)acrylate.