Semiconductor device and method of manufacturing the same
A semiconductor device includes a semiconductor chip, a bump electrode, a molding portion, a redistribution layer and an outer connection electrode. The bump electrode is provided on an upper face of the semiconductor chip. The molding portion encapsulates an entire side face of the semiconductor chip and seals the bump electrode so that a part of the bump electrode is exposed. The redistribution layer is provided on an upper face of the molding portion and is electrically coupled to the semiconductor chip via the bump electrode. The outer connection electrode is provided on an upper face of the redistribution layer and is electrically coupled to the bump electrode via the redistribution layer.
1. A semiconductor device comprising:
a semiconductor chip;
a bump electrode, at least partially spheroidal in shape, having a height of approximately 300 micrometers, formed on an upper face of the semiconductor chip wherein the bump electrode physically contacts the upper face of the semiconductor chip, wherein an upper face of the bump electrode is flat and wherein a lower face of the bump electrode that physically contacts the upper surface of the semiconductor chip is flat;
a molding portion that seals an entire side face of the semiconductor chip and seals the bump electrode so that a part of the bump electrode is exposed;
a planar redistribution layer formed on an upper face of the molding portion and connected to the exposed part of the bump electrode, electrically coupled to the semiconductor chip via the bump electrode, wherein the height of the bump electrode is measured from the planar redistribution layer to the upper face of the semiconductor chip; and
a spheroidal outer connection electrode formed on an upper face of the redistribution layer that extends laterally beyond the redistribution layer, wherein the spheroidal outer connection electrode is electrically coupled to the bump electrode via the redistribution layer, wherein the spheroidal outer connection electrode is one of a plurality of outer connection electrodes that each lie laterally beyond sides of the semiconductor chip and wherein the bump electrode and the spheroidal outer connection electrode are positioned on opposite sides of the redistribution layer, wherein the redistribution layer is positioned directly underneath and connected to the spheroidal outer connection electrode.
2. The semiconductor device as claimed in claim 1 , wherein the upper face of the molding portion is flat.
3. The semiconductor device as claimed in claim 1 , wherein an interval between the spheroidal outer connection electrodes is larger than that between bump electrodes.
4. The semiconductor device as claimed in claim 1 , further comprising a substrate that is fixed to a lower face of the semiconductor chip.
5. The semiconductor device as claimed in claim 4 , wherein the substrate is a silicon substrate.
6. The semiconductor device as claimed in claim 1 , further comprising an insulating portion,
wherein:
the insulating portion covers an entire side face and a portion of the upper face of the redistribution layer; and
a part of the spheroidal outer connection electrode is exposed.
7. The semiconductor device as claimed in claim 1 , wherein the spheroidal outer connection electrode is located radially outside of the bump electrode as measured from a center of the semiconductor chip.
8. The semiconductor device as claimed in claim 1 , further comprising forming a fixing portion from epoxy resin that is coextensive with and fixed to a lower face of the semiconductor chip, wherein the fixing portion is encapsulated by the molding portion at both sides and a substrate at a bottom of the fixing portion.
9. The semiconductor device as claimed in claim 1 , wherein the bump electrode is one of a plurality of bump electrodes.
10. The semiconductor device as claimed in claim 1 , wherein the outer electrode is one of a plurality of spheroidal outer electrodes.
11. A method of manufacturing a semiconductor device comprising:
forming a bump electrode, at least partially spheroidal in shape, having a height of approximately 300 micrometers, on an upper face of a semiconductor chip, wherein the bump electrode physically contacts the upper face of the semiconductor chip, wherein an upper face of the bump electrode is flat and wherein a lower face of the bump electrode that physically contacts the upper surface of the semiconductor chip is flat;
fixing the semiconductor chip to an upper face of a substrate;
forming a molding portion that seals an entire face of the semiconductor chip and seals the bump electrode so that a part of the bump electrode is exposed;
forming a planar redistribution layer on an upper face of the molding portion and connected to the exposed part of the bump electrode so that the redistribution layer is electrically coupled to the bump electrode, wherein the height of the bump electrode is measured from the planar redistribution layer to the upper face of the semiconductor chip; and
forming a spheroidal outer connection electrode, on an upper face of the redistribution layer that extends laterally beyond the redistribution layer so that the spheroidal outer connection electrode is electrically coupled to the bump electrode via the redistribution layer, wherein the spheroidal outer connection electrode is one of a plurality of outer connection electrodes that each lie laterally beyond sides of the semiconductor chip and wherein the bump electrode and the spheroidal outer connection electrode are positioned on opposite sides of the redistribution layer, wherein the redistribution layer is positioned directly underneath and connected to the spheroidal outer connection electrode.
12. The method of claim 11 , wherein the substrate is a silicon substrate.
13. The method of claim 11 , wherein to form the molding portion the method comprises:
arranging the substrate in a mold having a recess; and
forming the molding portion so as to seal the semiconductor chip.
14. The method of claim 11 , wherein to form the molding portion the method comprises fabricating the upper face of the molding portion and the upper face of the bump electrode to be flat.
15. The method of claim 11 , further comprising removing the substrate after forming the spheroidal outer connection electrode.
16. The method of claim 15 , wherein to remove the substrate the method comprises reducing a thickness of the semiconductor chip and a thickness of the molding portion.
17. The method of claim 11 , further comprising forming an insulating portion after forming the redistribution layer,
wherein the insulating portion is formed so that the insulating portion covers an entire side face and an entire upper face of the redistribution layer and a region of the redistribution layer where the spheroidal outer connection electrode is to be connected is exposed.
18. The method of claim 11 , further comprising individuating the semiconductor device after forming the spheroidal outer connection electrode.
19. The method of claim 11 , wherein to form the spheroidal outer connection electrode the method comprises forming the spheroidal outer connection electrode radially outside of the bump electrode as measured form a center of the semiconductor chip.
20. The method of claim 11 , wherein to fix the semiconductor chip to an upper face of the substrate the method comprises forming a fixing portion from epoxy resin that is coextensive with and fixed to a lower face of the semiconductor chip, wherein the fixing portion is encapsulated by the molding portion at both sides and the substrate at a bottom of the fixing portion.