IP Library Patent Application 12040292
Patent Application
App. No. 12/040,292

INLINE VACUUM PROCESSING APPARATUS AND METHOD FOR PROCESSING SUBSTRATES THEREIN

Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US None
App. No.
12/040,292
Abstract

An inline vacuum processing apparatus for processing of substrates in vacuum comprises at least one load-lock chamber, at least two subsequent deposition chambers to be operated with essentially the same set of coating parameters and at least one unload-lock chamber plus means for transferring, post-processing and/or handling substrates through and in the various chambers. A method for depositing a thin film on a substrate in such processing system comprises the steps of introducing a first substrate into a load-lock chamber, lowering the pressure in said chamber; transferring the substrate into a first deposition chamber; depositing a layer of a first material on said first substrate using a first set of coating parameters; transferring said first substrate into a second, subsequent deposition chamber of said inline system without breaking vacuum and depositing a further layer of said first material on said first substrate using substantially the same set of parameters. Simultaneously to step f) a second substrate is being treated in said inline vacuum system according to step d).

Claims (22)

1 . A method for depositing a thin film on a substrate in an inline vacuum processing system comprising the following steps:

a) introducing a first substrate into a load-lock chamber ( 2 ),

b) lowering the pressure in said chamber

c) transferring said first substrate into a first deposition chamber ( 4 )

d) depositing a layer of a first material at least partially on said first substrate using a first set of coating parameters

e) transferring said first substrate into a second, subsequent deposition chamber ( 5 ) of said inline system without breaking vacuum

f) depositing a further layer of said first material at least partially on said first substrate using substantially the same set of parameters

g) transferring said first substrate into a load lock chamber ( 10 )

h) removing said first substrate from said system wherein simultaneously to step f) a second substrate is being treated in said inline vacuum system according to step d)

2 . The method according to claim 1 , wherein said first set of deposition parameters comprises gas flow, chemical substances and pressure.

3 . The method according to claim 1 , wherein said depositing includes one of CVD, PECVD, LPCVD, PVD or reactive PVD.

4 . The method according to claim 1 , wherein step b) comprises an additional heating step of the substrate.

5 . The method according to claim 1 , wherein said at least partially deposited layer is deposited in equal 1/n parts of the desired overall thickness in said deposition chambers.

6 . The method according to claim 1 , wherein said method may use reactants like water in liquid or gaseous form, organometallic substances like diethylzinc (dez) and diboran as dopant.

7 . An apparatus for the inline vacuum processing of substrates comprising

At least one load-lock chamber ( 2 ),

At least two subsequent deposition chambers ( 4 , 5 ) to be operated with essentially the same set of coating parameters,

At least one unload-lock chamber ( 10 ) and

Means for transferring, post-processing and/or handling substrates through and in the various chambers

8 . Apparatus according to claim 7 , the deposition chambers further comprising means for substrate transport, said means being retractable wheels or rollers ( 36 ) and being vertically movable pins adapted to lift the substrate from the rollers.

9 . Apparatus according to claim 7 , wherein the deposition chambers ( 4 , 5 ) and the load and unload chambers ( 2 , 10 ) are being arranged subsequently in a straight line and that underneath the chambers, back-transport means ( 21 - 26 ) are being arranged for moving substrates in opposite direction with respect to the deposition process of the upper chambers.

10 . An apparatus according to claim 9 , wherein the load station comprises a lift or elevator for lifting the processed substrate from the back-transport means in order to receive the coated substrate at a site where at least a worker or a machine can handle it and stock it apart.

Assignments (5)
LICENSE Recorded Aug 1, 2014
From: TEL SOLAR AG
To: OC OERLIKON BALZERS AG
Reel/Frame 033459/0821 →
CHANGE OF NAME Recorded Aug 16, 2013
From: OERLIKON SOLAR AG, TRUBBACH
To: TEL SOLAR AG
Reel/Frame 031029/0927 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 7, 2010
From: OERLIKON TRADING AG, TRUBBACH
To: OERLIKON SOLAR AG, TRUBBACH
Reel/Frame 025459/0798 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 26, 2009
From: OC OERLIKON BALZERS AG
To: OERLIKON TRADING AG, TRUBBACH
Reel/Frame 022151/0148 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2008
From: ZINDEL, ARNO; POPPELLER, MARKUS; ZIMIN, DMITRY; KUHN, HANSJORG; KERSCHBAUMER, JORG
To: OC OERLIKON BALZERS AG
Reel/Frame 020736/0790 →