Methods and apparatuses for improved positioning in a probing system
View Patent ↗An improved method and apparatus for automatically and accurately aligning a wafer prober to the bonding pads of a semiconductor device are provided. In one embodiment of one aspect of the invention, a multi-loop feedback control system incorporating information from a number of sensors is used to maintain the desired contact position in the presence of disturbances. Other aspects and other embodiments are also described.
1. A testing system operable to accurately maintain a relative position between a plurality of contact electrodes and a plurality of electrical contacts, the testing system comprising:
a first sensor coupled to a first component, the first component configured to hold a device coupled to the plurality of electrical contacts, wherein the first sensor is configured to measure a first parameter along an axis of a three-dimensional coordinate system and wherein the first sensor is coupled to an athermal mount;
a second sensor coupled to the first component, the second sensor configured to measure a second parameter along the axis;
a control system coupled to the first component configured to receive information from the first sensor and from the second sensor and configured to determine actuation forces based on the information and wherein the actuation forces act on the first component to maintain a desired relative position between the contact electrodes and the electrical contacts; and
a plurality of actuators coupled to the first component configured to exert the actuation forces determined by the control system and to eliminate a tilting of the first component caused by contact forces between the contact electrodes and the electrical contacts.
2. A testing system operable to accurately maintain a relative position between a plurality of contact electrodes and a plurality of electrical contacts, the testing system comprising:
a first component configured to hold a first device coupled to the plurality of electrical contacts;
a second component configured to hold a second device coupled to the plurality of contact electrodes and wherein the second component is configured to come in contact with the first component at high pressure;
a control system coupled to the first component and coupled to a plurality of sensors, wherein the sensors are configured to measure a tilt in the first component; and
a plurality of actuators coupled to the first component and to the control system and configured to receive a command from the control system and to apply forces to the first component to eliminate the tilt.