Circuit board surface structure and fabrication method thereof
A circuit board surface structure and a fabrication method thereof are proposed. The circuit board surface structure includes: a circuit board having a plurality of electrically connecting pads formed on at least one surface thereof; a first and a second insulating protective layers formed on the surface of the circuit board in sequence; first and a second openings respectively formed in the first and second insulating protective layers to expose the electrically connecting pads on the surface of the circuit board, wherein the first and second openings have narrow top and wide bottom and the diameter of the first openings is bigger than that of the second openings; and conductive elements formed in the first and second openings on surfaces of the electrically connecting pads. The present structure facilitates to strengthen the bonding between the conductive elements and the corresponding electrically connecting pads.
1. A circuit board surface structure, comprising:
a circuit board with at least one surface having a plurality of electrically connecting pads;
a first insulating protective layer and a second insulating protective layer formed on the surface of the circuit board in sequence;
a first opening and a second opening penetratingly formed in the first and second insulating protective layers respectively to expose the electrically connecting pads on the surface of the circuit board, wherein the first and second openings are tapered upward, and the first opening has a greater diameter than the second opening; and
conductive elements formed on a part of the top surface of the second insulating protective layer and surfaces of the electrically connecting pads in the first and second openings, wherein each of the conductive elements is a solder or a metal bump, and the width of each of the conductive elements formed on a part of the top surface of the second insulating protective layer is larger than width of the second opening.
2. The circuit board surface structure of claim 1 , wherein the first and second insulating protective layers have different composition ratios.
3. The circuit board surface structure of claim 2 , wherein the composition ratio of photo-polymerization material in the first insulating protective layer is smaller than the composition ratio of photo-polymerization material in the second insulating protective layer.
4. The circuit board surface structure of claim 2 , wherein photo-polymerization material in the first and second insulating protective layers is an acrylate-based material.
5. The circuit board surface structure of claim 2 , wherein the first insulating protective layer features one of presence and absence of a solder resisting effect, and the second insulating protective layer features presence of a solder resisting effect.
6. The circuit board surface structure of claim 1 , further comprising a conductive layer disposed between the electrically connecting pads and the conductive elements, between a wall of the first opening and the conductive elements, between a wall of the second opening and the conductive elements, and between the second insulating protective layer and the conductive elements.
7. The circuit board surface structure of claim 1 , wherein the solder is made of one selected from the group consisting of Pb, Sn, Ag, Cu, Au, Bi, Sb, Zn, Ni, Zr, Mg, In, Te, and Ga.
8. The circuit board surface structure of claim 1 , wherein the metal bump is made of Cu.