IP Library Granted Patent US 8,137,161
Granted Patent B2
US 8,137,161 · App. 12/054,078 · Granted Mar 20, 2012

Disk-shaped substrate manufacturing method

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Quick Facts
Patent No.
US 8,137,161
App. No.
12/054,078
Granted
Mar 20, 2012
Kind
B2
Abstract

The disk-shaped substrate manufacturing method is provided with: generating an air stream downward from an upper area during grinding a disk-shaped substrate in a grinding apparatus; arranging the grinding apparatus on an upper floor face of a floor and arranging water on a lower floor face of the floor, the upper floor face being made of a board having penetration holes or a mesh member, and the lower floor face supporting the upper floor face so as to be located above the lower floor face with a distance; and guiding dust made by the grinding apparatus to the water by use of the air stream.

Claims (22)

1. A disk-shaped substrate manufacturing method, where a disk-shaped substrate is ground under a dust removal environment that is not a clean room as a previous step of a process performed in a clean room, comprising:

grinding a disk-shaped substrate in a grinding apparatus that contains piping or wiring of the grinding apparatus on which dust accumulates on the piping or wiring and falls therefrom;

generating an air stream downward from an upper area with respect to the grinding apparatus placed in the dust removal environment during grinding the disk-shaped substrate in the grinding apparatus;

performing the grinding in a grinding apparatus that is arranged on an upper floor face of a floor while water is present on a lower floor face of the floor, the upper floor face being made of a board having penetration holes or a mesh member, and the lower floor face supporting the upper floor face so as to be located above the lower floor face with a distance;

guiding dust made by the grinding apparatus to the water by use of the air stream; and

reducing contact of dust accumulated on the piping or the wiring and falling therefrom to the disk-shaped substrate in processing by grinding the disk-shaped substrate in a grinding apparatus that contains the piping or wiring of the grinding apparatus below a processing area of the grinding apparatus.

2. The disk-shaped substrate manufacturing method according to claim 1 , wherein the upper floor face is a lath board made of a metal board having a series of penetration holes.

3. The disk-shaped substrate manufacturing method according to claim 1 , wherein the water on the lower floor face forms a flow below the upper floor face.

4. The disk-shaped substrate manufacturing method according to claim 1 , wherein

the upper floor face also spreads in a working area for an operator handling the grinding apparatus, and

an air steam is generated in the working area so as to guide dust to the water, while the grinding apparatus is exposed to the air stream.

5. A disk-shaped substrate manufacturing method, where a disk-shaped substrate is polished under a dust removal environment that is not a clean room as a previous step of a process performed in a clean room, comprising:

polishing a disk-shaped substrate in a polishing apparatus that contains piping or wiring of the polishing apparatus on which dust accumulates on the piping or wiring and falls therefrom;

generating an air stream downward from an upper area with respect to a polishing apparatus placed in the dust removal environment during polishing a disk-shaped substrate in the polishing apparatus during polishing a disk-shaped substrate in the polishing apparatus;

performing the polishing in a polishing apparatus that is arranged on an upper floor face of a floor while water is present on a lower floor face of the floor, the upper floor face being made of a board having penetration holes or a mesh member, and the lower floor face supporting the upper floor face so as to be located above the lower floor face with a distance;

guiding dust made by the polishing apparatus to the water by use of the air stream; and

reducing contact of dust accumulated on the piping or the wiring and falling therefrom to the disk-shaped substrate in processing by polishing the disk-shaped substrate in a polishing apparatus that contains the piping or wiring of the polishing apparatus below a processing area of the polishing apparatus.

6. The disk-shaped substrate manufacturing method according to claim 5 , wherein the upper floor face is a lath board made of a metal board having a series of penetration holes.

7. The disk-shaped substrate manufacturing method according to claim 5 , wherein the water on the lower floor face forms a flow below the upper floor face.

8. The disk-shaped substrate manufacturing method according to claim 5 , wherein

the upper floor face also spreads in a working area for an operator handling the polishing apparatus, and

an air steam is generated in the working area so as to guide dust to the water, while the polishing apparatus is exposed to the air stream.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 8, 2012
From: CITIZEN SEIMITSU CO., LTD.
To: SHOWA DENKO K.K.
Reel/Frame 028347/0110 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 24, 2008
From: HANEDA, KAZUYUKI; FUJINAMI, SATOSHI; JONOUCHI, TAKESHI
To: SHOWA DENKO K.K.; CITIZEN SEIMITSU CO., LTD.
Reel/Frame 020693/0808 →