Patent Assignment
Reel/Frame 028347/0110
Assignment of Assignor's Interest
Recorded: 2012-06-08
Pages: 3
Assignor
CITIZEN SEIMITSU CO., LTD.
Executed: 2012-05-23
Assignee
SHOWA DENKO K.K.
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Properties
(4)
Disk-Shaped Substrate Inner Circumference Polishing Method
Polishing Apparatus, Polishing Brush and Manufacturing Method of Disk-Shaped Substrate
Grinding Method of a Disk-Shaped Substrate and Grinding Apparatus
Disk-Shaped Substrate Manufacturing Method
Related Assignments
(7)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 11, 2007
From: HANEDA, KAZUYUKI; WATANABE, KUNIZO; SATO, YOSUKE
To: SHOWA DENKO K.K.; CITIZEN SEIMITSU CO., LTD.
Reel/Frame 019853/0367 →
Assignment of Assignor's Interest
Nov 21, 2007
From: HANEDA, KAZUYUKI; SATO, YOSUKE
To: SHOWA DENKO K.K.; CITIZEN SEIMITSU CO., LTD.
Reel/Frame 020146/0556 →
Assignment of Assignor's Interest
Jan 15, 2008
From: HANEDA, KAZUYUKI; FUJINAMI, SATOSHI
To: SHOWA DENKO K.K.; CITIZEN SEIMITSU CO., LTD.
Reel/Frame 020367/0458 →
Assignment of Assignor's Interest
Mar 24, 2008
From: HANEDA, KAZUYUKI; FUJINAMI, SATOSHI; JONOUCHI, TAKESHI
To: SHOWA DENKO K.K.; CITIZEN SEIMITSU CO., LTD.
Reel/Frame 020693/0808 →
Change of Name
Jun 23, 2023
From: SHOWA DENKO K.K.
To: RESONAC CORPORATION
Reel/Frame 064082/0513 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →
Assignment of Assignor's Interest
Oct 15, 2024
From: RESONAC CORPORATION
To: RESONAC HARD DISK CORPORATION
Reel/Frame 069167/0673 →