Patent Assignment
Reel/Frame 020367/0458
Assignment of Assignor's Interest
Recorded: 2008-01-15
Pages: 4
Assignees
SHOWA DENKO K.K.
13-9, SHIBADAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
CITIZEN SEIMITSU CO., LTD.
6663-2, FUNATSU FUJIKAWAGUCHIKOMACHI, MINAMITSURU-GUN, YAMANASHI, 401-0395, JAPAN
Covered Property
(1)
Grinding Method of a Disk-Shaped Substrate and Grinding Apparatus
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 8, 2012
From: CITIZEN SEIMITSU CO., LTD.
To: SHOWA DENKO K.K.
Reel/Frame 028347/0110 →
Change of Name
Jun 23, 2023
From: SHOWA DENKO K.K.
To: RESONAC CORPORATION
Reel/Frame 064082/0513 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →
Assignment of Assignor's Interest
Oct 15, 2024
From: RESONAC CORPORATION
To: RESONAC HARD DISK CORPORATION
Reel/Frame 069167/0673 →