System and method of forming a low profile conformal shield

1. A method of forming a conformal shield, comprising:

applying a conformal insulating coating to an electrical system;

forming a plurality of openings in the insulating coating at desired locations;

depositing a first metallic layer over the insulating coating and in each of the plurality of openings, the first metallic layer being electrically connected with the electrical system at the desired locations;

depositing a second metallic layer onto the first metallic layer; and

wherein the method further comprises:

applying a protective coating onto a back surface of the electrical system prior to depositing the first metallic layer; and

removing the protective coating from the back surface of the electrical system subsequent to depositing of the second metallic layer.

2. The method of claim 1 wherein applying the conformal insulating coating comprises spray coating the insulating coating on the electrical system.

3. The method of claim 1 wherein applying the conformal insulating coating comprises dip coating the electrical system in the insulating coating.

4. The method of claim 1 wherein applying the conformal insulating coating comprises:

placing a thermoplastic film over the electrical system;

positioning a silicone layer over the thermoplastic film;

applying heat and pressure to the thermoplastic film and the silicone layer to shape the thermoplastic film so as to conform to the electrical system.

5. The method of claim 1 wherein the conformal insulating coating comprises one of an ultraviolet-curable polymer, an epoxy coating, and a silicone-based coating.

6. The method of claim 1 wherein forming the plurality of openings in the insulating coating comprises laser-ablating the insulating coating at locations corresponding to contact pads on the electrical system.

7. The method of claim 1 wherein forming the plurality of openings in the insulating coating comprises:

applying a masking layer over contact pads on the electrical system prior to application of the insulating coating; and

removing the masking layer from the contact pads after application of the insulating coating so as to form openings in the insulating coating.

8. The method of claim 1 wherein depositing the first metallic layer comprises one of electroless plating, sputtering, and evaporating.

9. The method of claim 1 wherein depositing the second metallic layer comprises electroplating the second metallic layer onto the first metallic layer.

10. The method of claim 1 further comprising:

performing a functionality test on the electrical system after depositing the second metallic layer onto the first metallic layer; and

if the electrical system fails the functionality test, then:

reapplying the protective coating;

etching off the first and second metallic layers; and

removing the insulating coating to allow for reworking of the electrical system.

11. The method of claim 1 wherein the first and second metallic layers have a combined thickness of between approximately 2 and 5 micrometers.

12. The method of claim 1 wherein the electrical system comprises a circuit board and circuit board components positioned thereon.

13. A method for manufacturing a conformal shield, comprising:

applying an ultraviolet-curable polymer coating to a circuit board;

forming an opening in the polymer coating adjacent to each of a plurality of contact pads on the circuit board;

depositing a conductive layer over the polymer coating and in the opening adjacent to each of the plurality of contact pads, the conductive layer being electrically coupled to the circuit board at the plurality of contact pads; and

increasing a thickness of the conductive layer to increase at least one of a radio frequency (RF) shielding property and an electromagnetic (EM) shielding property of the conductive layer; and

wherein the method further comprises:

applying a protective coating onto a back surface of the circuit board prior to depositing the conductive layer; and

removing the protective coating from the back surface of the circuit board subsequent to electroplating the second metallic layer.

14. The method of claim 13 wherein forming an opening in the polymer insulating coating adjacent to each of a plurality of contact pads comprises laser-ablating the insulating coating at locations corresponding to contact pads on the circuit board.

15. The method of claim 13 wherein depositing a conductive layer comprises one of electroless plating, sputtering, and evaporating a metallic layer on the polymer coating.

16. The method of claim 13 wherein increasing the thickness of the conductive layer comprises electroplating a second metallic layer onto the conductive layer.

17. A method of forming a conformal shield, comprising:

applying a conformal insulating coating to an electrical system, wherein applying the conformal insulating coating comprises:

placing a thermoplastic film over the electrical system;

positioning a silicone layer over the thermoplastic film; and

applying heat and pressure to the thermoplastic film and the silicone layer to shape the thermoplastic film so as to conform to the electrical system;

forming a plurality of openings in the thermoplastic film at desired locations;

depositing a first metallic layer over the thermoplastic film and in each of the plurality of openings, the first metallic layer being electrically connected with the electrical system at the desired locations; and

depositing a second metallic layer onto the first metallic layer.

18. The method of claim 17 wherein applying the conformal insulating coating further comprises removing the silicone layer before the step of forming the plurality of openings in the thermoplastic film at desired locations.