Laser machining of fired ceramic and other hard and/or thick materials
View Patent ↗Laser machining fired ceramic and other hard and/or thick materials includes scribing a workpiece with a laser beam along a sequence of parallel laser paths within a cutout region of the workpiece. The scribing creates a kerf in the cutout region that widens as the laser beam advances along the sequence. The sequence may begin with an inner portion of the cutout region and end with an outer edge thereof such that debris is directed away from the laser paths to increase throughput and create a high quality opening in the workpiece. High quality structures may also be cut out from the workpiece. The method includes directing a high velocity stream of gas to an interface of the laser beam and the workpiece to redirect the flow of debris and cool the interface. The method may also adjust a focus depth of the laser beam as it deepens the kerf.
1. A method of laser machining a fired ceramic or other hard material, the method comprising:
scribing a workpiece with a laser beam along a sequence of parallel laser paths within a cutout region of the workpiece, wherein the scribing creates a kerf in the cutout region that widens and deepens as the laser beam advances from a first laser path to a second laser path in the sequence so as to create a series of parallel descending steps as an escape for debris; and
directing a high velocity stream of gas to an interface between the laser beam and the workpiece, wherein the stream of gas directs the debris away from the sequence of parallel laser paths, and wherein the debris is generated by an interaction of the laser beam with the workpiece.
2. The method of claim 1 , further comprising:
setting a first focus depth of the laser beam;
directing a first pass of the laser beam along one or more of the parallel laser paths to remove a first portion of the workpiece corresponding to the first focus depth;
setting a second focus depth of the laser beam; and
directing a second pass of the laser beam along the one or more parallel laser paths to remove a second portion of the workpiece corresponding to the second focus depth.
3. The method of claim 1 , wherein the sequence begins with an inner portion of the cutout region and ends with an outer edge of the cutout region.
4. The method of claim 3 , wherein scribing the workpiece along the sequence of parallel laser paths cuts a series of parallel steps within the kerf descending from the inner portion of the cutout region to the outer edge of the cutout region.
5. The method of claim 3 , further comprising cutting through the workpiece with the laser beam along the outer edge to remove the cutout region from the workpiece, wherein directing the debris away from the sequence of parallel laser paths allows the outer edge to be substantially smooth and free from the debris.
6. The method of claim 1 , wherein the sequence begins with an outer edge of the cutout region and moves toward an inner portion of the cutout region.
7. The method of claim 6 , further comprising cutting through the workpiece with the laser beam to remove a structure therefrom, the structure comprising the inner portion of the cutout region, wherein directing the debris away from the sequence of parallel laser paths allows the structure to be substantially smooth and free from the debris.
8. The method of claim 7 , wherein scribing the workpiece along the sequence of parallel laser paths cuts a series of parallel steps within the kerf descending from the outer edge of the cutout region toward the structure being cut from the cutout region.
9. The method of claim 1 , wherein directing the high velocity stream of gas to the interface comprises blowing the stream of gas through a nozzle at supersonic speed.
10. The method of claim 9 , further comprising locating the nozzle within 20 mm of the interface.
11. The method of claim 1 , wherein the gas is selected from the group comprising air, oxygen and carbon dioxide.
12. The method of claim 1 , wherein the gas comprises a neutral gas selected from the group comprising argon, helium and nitrogen.