Enhanced implantable antenna method
As described herein vascular anchoring systems are used to position an implant in a vascular area such as a bifurcated vasculature with relatively high fluid flow, for instance, in an area of a pulmonary artery with associated left and right pulmonary arteries. Implementations include an anchoring trunk member having a first anchoring trunk section and a second anchoring trunk section. Further implementations include a first anchoring branch member extending from the anchoring trunk member. Still further implementations include a second anchoring branch member extending from the anchoring trunk member.
1. A method for manufacturing a flexible implantable antenna, including the steps:
a. Selecting a superelastic metal
b. Selecting a second metal with higher electrical conductivity than the superelastic metal
c. Forming the superelastic metal into an H-field loop antenna
d. Encapsulating the superelastic metal with the second metal having higher electrical conductivity wherein the superelastic antenna transitions from a martensitic phase to a compressible austenitic phase when implanted
e. Electrically connecting the second metal with higher electrical conductivity to at least one point of an electronic circuit
f. Enclosing the electronic circuit within an implantable enclosure wherein a first end of the H-field loop antenna is coupled to the electronic circuit within the implantable enclosure and a second end of the H-field loop antenna is coupled to the electronic circuit within the implantable enclosure.
2. A method for manufacturing a flexible implantable antenna, including the steps:
a. Selecting a first metal or metal alloy with two solid metallurgical phases and a transition temperature
b. Selecting a second metal with higher electrical conductivity than the two-phase metal
c. Forming the two-phase metal into a loop antenna by shape-setting it at a higher temperature
d. Encapsulating the superelastic metal with the second metal having a higher electrical conductivity
e. Electrically connecting the metal with higher electrical conductivity to at least one point of an electronic circuit
f. Enclosing the electronic circuit within an implantable enclosure wherein a first end of the H-field loop antenna is coupled to the electronic circuit within the implantable enclosure and a second end of the H-field loop antenna is coupled to the electronic circuit within the implantable enclosure.
3. As in claim 2 , where the two-phase metal is a nickel-titanium alloy.
4. As in claim 2 , where the two phases are austenite and martensite.