IP Library Granted Patent US 8,067,788
Granted Patent B2
US 8,067,788 · App. 12/061,065 · Granted Nov 29, 2011

Semiconductor device

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Quick Facts
Patent No.
US 8,067,788
App. No.
12/061,065
Granted
Nov 29, 2011
Kind
B2
Abstract

A semiconductor device includes a substrate common to a first field effect transistor and a second field effect transistor, a channel layer of a first conductivity type formed on the substrate and common to the first and second field effect transistors, a an upper compound semiconductor layer formed on the channel layer and common to the first and second field effect transistors, a compound semiconductor region of a second conductivity type formed in the same layer as the upper compound semiconductor layer, a gate electrode of the first field effect transistor in ohmic contact with the compound semiconductor region, and a gate electrode of the second field effect transistor in Schottky contact with the upper compound semiconductor layer.

Claims (24)

1. A semiconductor device, comprising:

a substrate common to a first field effect transistor and a second field effect transistor;

a channel layer of a first conductivity type formed on the substrate and common to the first and second field effect transistors;

an upper compound semiconductor layer formed on the channel layer and common to the first and second field effect transistors;

a compound semiconductor region of a second conductivity type formed in the same layer as the upper compound semiconductor layer;

a gate electrode of the first field effect transistor in ohmic contact with the compound semiconductor region at a position spaced apart from said upper compound semiconductor layer; and

a gate electrode of the second field effect transistor in Schottky contact with the upper compound semiconductor layer.

2. The semiconductor device according to claim 1 , further comprising:

an isolation layer for electrically isolating the first field effect transistor and the second field effect transistor.

3. The semiconductor device according to claim 1 , further comprising:

an electron supply layer common to the first and second field effect transistor; and

a spacer layer formed between the channel layer and the electron supply layer and common to the first and second field effect transistors.

4. The semiconductor device according to claim 1 , wherein the compound semiconductor region of second conductivity type is a regrown compound semiconductor layer that is deposited in a recess provided in the upper compound semiconductor layer.

5. The semiconductor device according to claim 1 , wherein the gate electrode of the second field effect transistor has a portion embedded in a recess provided in the upper compound semiconductor layer.

6. The semiconductor device according to claim 5 , wherein the gate electrode of the second field effect transistor does not abut the inner wall of the recess provided in the upper compound semiconductor layer.

7. The semiconductor device according to claim 1 , wherein the first field effect transistor is an enhancement-mode field effect transistor, and the second field effect transistor is a depletion-mode field effect transistor.

8. The semiconductor device according to claim 1 , wherein the first field effect transistor is a field effect transistor for a power amplifier circuit, and the second field effect transistor is a field effect transistor for a switching circuit.

9. The semiconductor device according to claim 1 , wherein an impurity concentration in the compound semiconductor region is set such that a potential barrier corresponding to a bandgap of the compound semiconductor region becomes greater than a potential barrier corresponding to a Schottky junction between the gate electrode of the second field effect transistor and the upper compound semiconductor layer.

10. The semiconductor device according to claim 1 , wherein the upper compound semiconductor layer is a first conductivity type layer and the compound semiconductor region is a second conductivity type region.

11. The semiconductor device according to claim 1 , wherein the upper compound semiconductor layer is a P-type layer and the compound semiconductor region is a N-type region.

12. The semiconductor device according to claim 9 , wherein the upper compound semiconductor layer is a first conductivity type layer and the compound semiconductor region is a second conductivity type region.

13. The semiconductor device according to claim 9 , wherein the upper compound semiconductor layer is a P-type layer and the compound semiconductor region is a N-type region.

14. The semiconductor device according to claim 3 , wherein an impurity concentration in the compound semiconductor region is greater than an impurity concentration in the electron supply layer.

15. The semiconductor device according to claim 1 , wherein a potential barrier corresponding to a bandgap of the compound semiconductor region is greater than a potential barrier corresponding to a Schottky junction between the gate electrode of the second field effect transistor and the upper compound semiconductor layer.

Assignments (3)
CHANGE OF ADDRESS Recorded Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →
CHANGE OF NAME Recorded Nov 2, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025235/0497 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 2, 2008
From: BITO, YASUNORI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 020743/0069 →