IP Library Granted Patent US 8,124,989
Granted Patent B2
US 8,124,989 · App. 12/061,623 · Granted Feb 28, 2012

Light optoelectronic device and forming method thereof

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Quick Facts
Patent No.
US 8,124,989
App. No.
12/061,623
Granted
Feb 28, 2012
Kind
B2
Abstract

The present invention provides an optoelectronic device with an epi-stacked structure, which includes a substrate, a buffer layer that is formed on the substrate, in which the buffer layer includes a first nitrogen-containing compound layer, an II/V group compound layer is provided on the first nitrogen-containing compound layer, a second nitrogen-containing compound layer is provided on the II/V group compound layer, and a third nitrogen-containing compound layer is provided on the second nitrogen-containing compound layer, an epi-stacked structure with a multi-layer structure is formed on the buffer layer, which includes a first semiconductor conductive layer is formed on the buffer layer, an active layer is formed on the first semiconductor conductive layer, a multi-layer structure is formed between the first semiconductor conductive layer and the active layer, and a second semiconductor conductive layer is formed on the active layer.

Claims (143)

1. An optoelectronic device with an epi-stacked structure, comprising:

a substrate;

a buffer layer formed on said substrate, said buffer layer comprising at least:

a first nitride based compound layer on said substrate;

a II/V group compound layer on said first nitride-containing compound layer;

a second nitride-containing compound layer on said II/V group compound layer; and

a third nitride-containing compound layer on said second nitride-containing compound layer; and

an epi-stacked structure formed on said buffer layer, wherein said epi-stacked structure comprises:

a first semiconductor conductive layer formed on said buffer layer;

a multi-layer structure with an average energy gap (Eg (avg,SRS) ) formed on said first semiconductor conductive layer, the multi-layer structure comprising:

a first semiconductor structure with an energy gap Eg 1 having a thickness t 1 ;

a second semiconductor structure with an energy gap Eg 2 having a thickness t 2 ; and

a third semiconductor structure with an energy gap Eg 3 sequentially stacked and having a thickness t 3 ;

wherein said average energy gap of the multi-layer structure satisfies

E

g

(

avg

,

S

R

S

)

=

(

t

1

E

g

1

+

t

2

E

g

2

+

t

3

E

g

3

)

t

1

+

t

2

+

t

3

;

an active layer with an energy gap (Eg ,active ) formed on said multi-layer structure wherein said energy gap (Eg ,active ) of said active layer is different from said average energy gap (Eg (avg,SRS) ) of said multi-layer structure; and

a second semiconductor conductive layer formed on said active layer.

2. The optoelectronic device with the epi-stacked structure according to claim 1 , wherein said second nitride-containing compound layer is an AlGaN layer.

3. The optoelectronic device with the epi-stacked structure according to claim 1 , wherein said third nitride-containing compound layer is an Al x In y Ga 1-x-y N layer.

4. The optoelectronic device with the epi-stacked structure according to claim 1 , wherein said first semiconductor conductive layer comprises at least a first portion and an exposed second portion.

5. The optoelectronic device with the epi-stacked structure according to claim 1 , wherein said multi-layer semiconductor structure layer comprises a plurality of multi-layer semiconductor structures.

6. The optoelectronic device with the epi-stacked structure according to claim 1 , wherein said active layer is selected from the groups consisting of: InGaN layer, multi quantum well (MQW) and a quantum well (QW).

7. An optoelectronic device with a multi-layer structure, comprising:

a substrate;

an epi-stacked structure formed on said substrate, wherein said epi-stacked structure comprises:

an active layer with an energy gap (Eg ,active )

a multi-layer structure with an average energy gap (Eg (avg,SRS) ) the multi-layer structure comprising:

a first semiconductor structure with an energy gap Eg 1 having a thickness t 1 ;

a second semiconductor structure with an energy gap Eg 2 having a thickness t 2 ; and

a third semiconductor structure with an energy gap Eg 3 sequentially stacked and having a thickness t 3 ;

wherein said average energy gap of multi-layer structure satisfies

E

g

(

avg

,

S

R

S

)

=

(

t

1

E

g

1

+

t

2

E

g

2

+

t

3

E

g

3

)

t

1

+

t

2

+

t

3

,

and said energy gap (Eg ,active ) of said active layer is different from said average energy gap (Eg avg,SRS) ) of said multi-layer structure.

8. The optoelectronic device with the multi-layer structure according to claim 7 , said multi-layer structure are undoped components.

9. The optoelectronic device with the multi-layer structure according to claim 7 , wherein the first semiconductor structure, the second semiconductor structure and the third semiconductor structure are respectively GaN layer, AlGaN layer and InGaN layer.

10. The optoelectronic device with the multi-layer structure according to claim 7 , wherein the multi-layer structure formed over the active layer.

11. The optoelectronic device with the multi-layer structure according to claim 7 , wherein the multi-layer structure formed below the active layer.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 13, 2016
From: HUGA OPTOTECH INC.
To: EPISTAR CORPORATION
Reel/Frame 040350/0699 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 2, 2008
From: TSAI, TZONG-LIANG
To: HUGA OPTOTECH INC.
Reel/Frame 020746/0326 →