Thermode device for a multitude of semiconductor components
A thermode device for connecting and/or electrically contacting a plurality of first semiconductor components to at least one support element and/or to a plurality of second semiconductor components by heating an adhesive under the application of pressure. An example thermode device includes a basic body and a heating element which can be extended out of the basic body and which, under the application of pressure, acts on at least one of the first semiconductor components, wherein the basic body has on its underside a plurality of heating plates which are oriented vertically and are arranged next to one another. Each heating plate has on its end and underside a plurality of the extendable heating elements, to the underside of each of which there is assigned a first semiconductor component.
1. A thermode device for connecting or electrically connecting a plurality of first semiconductor components to at least one support element or to a plurality of second semiconductor components by heating an adhesive under the application of pressure, the thermode device comprising:
a basic body which comprises on its underside a plurality of heating plates which are oriented vertically and are arranged next to one another, each heating plate including at least one heater for generating heat and heating the heating plate; and
a heating element which is extendable out of the basic body and which, under the application of pressure, acts on at least one of the first semiconductor components, wherein each heating plate has on its end and underside a plurality of the extendable heating elements, to the underside of each of which there is assigned a first semiconductor component, wherein each heating element is a separate element from the at least one heater, and wherein the plurality of heating elements extending from each heating plate are heated by the heating plate that has been heated by the heater.
2. The thermode device of claim 1 , wherein each heating element is a cylindrical pin which can be displaced up and down inside the heating plate.
3. The thermode device of claim 1 , wherein distance between the heating elements, which are arranged parallel to one another, is less than 10 mm.
4. The thermode device of claim 3 , wherein each cylindrical pin is displaceable inside a cylindrical channel of complementary shape.
5. The thermode device of claim 4 , further comprising:
a spring element in contact with one end of the cylindrical pin; and
an adjusting element in contact with the spring element for individually adjusting a spring force of the spring element.
6. The thermode device of claim 5 , wherein the adjusting element comprises an adjusting screw.
7. The thermode device of claim 4 , further comprising a pneumatic compressed air cushion arranged at a first side of the cylindrical pin.
8. The thermode device of claim 7 , wherein the adjusting element comprises a pressure control system for individually adjusting a spring effect brought about by the compressed air cushion.
9. The thermode device of claim 1 , wherein the at least one heater is at least one heating wire for heating the heating plate.
10. The thermode device of claim 9 , wherein each heating plate includes a wire-type temperature sensor.
11. The thermode device of claim 1 , wherein distance between the heating elements, which are arranged parallel to one another, is less than 4 mm.
12. The thermode device of claim 2 , wherein each heating plate has a length, a width and thickness configured so that the length and width are substantially greater than the thickness and wherein the displacement direction of each cylindrical pin is parallel to the length or width direction of the heating plates.