IP Library Granted Patent US 10,294,389
Granted Patent B2
US 10,294,389 · App. 12/067,673 · Granted May 21, 2019

Use of phosphonic acid diesters and diphosphonic acid diesters and thermally curable mixtures containing phosphonic acid diesters and diphosphonic acid diesters

Inventors: Andreas Poppe (Sendenhorst, DE); Elke Westhoff (Steinfurt, DE); Beate Gebauer (Münster, DE); Peter Mayenfels (Münster, DE)
Assignee: BASF COATINGS GmbH
C09D175/04C08G18/289C08G18/388C08G18/3878C08G18/3882C08G18/42C08G18/792C08G18/809C08L67/00C09D167/00C08K5/524C08K5/527C08L61/00
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Quick Facts
Patent No.
US 10,294,389
App. No.
12/067,673
Granted
May 21, 2019
Kind
B2
Abstract

Disclosed herein is a thermally curable mixture, comprising at least one phosphonic diester (A), at least one diphosphonic diester (A), or at least one phosphonic diester and at least one diphosphonic diester (A); and at least one compound (B) which can be reacted by transesterification, transamidation, self-condensation of N-hydroxyalkylamino groups, self-condensation of N-alkoxyalkylamino groups, transacctalization of N-alkoxyalkylamino groups, acctalization of N-hydroxyalkylamino groups, or a combination thereof. Also disclosed is a process for making the thermally curable mixture, and a cured material comprising the product of thermally curing the mixture.

Claims (81)

1. A thermally curable, liquid mixture, comprising:

compounds (A) in an amount of 0.1 to 20 wt. %, wherein (A) comprises: at least one phosphonic diester (A), at least one diphosphonic diester (A), or at least one phosphonic diester and at least one diphosphonic diester (A);

at least one first compound (B) comprising at least two reactive functional groups comprising hydroxyl groups, which is selected from the group consisting of addition resins, condensation resins, and (co)polymers of olefinically unsaturated monomers; and

at least one second compound (B) comprising N-hydroxyalkylamino groups, N-alkoxyalkylamino groups, or a combination thereof, which is an amino resin and can be reacted by transesterification, transamidation, self-condensation of N-hydroxyalkylamino groups, self-condensation of N-alkoxyalkylamino groups, transacetalization of N-alkoxyalkylamino groups, acetalization of N-hydroxyalkylamino groups, or a combination thereof; and

at least one polyisocyanate (C) comprising at least two free isocyanate groups;

wherein the thermally curable, liquid mixture is a two-component or multi-component coating system, the two-component or multi-component coating system comprising the at least one first compound (B) comprising at least two reactive functional groups as a separate component (I) and the at least one polyisocyanate (C) as a separate component (II);

wherein a proportion of (B):(C) is in the range of 0.01 to 100, wherein (B) includes the total of the at least one first compound (B) comprising at least two reactive functional groups and the at least one second compound (B) comprising N-hydroxyalkylamino groups, N-alkoxyalkylamino groups, or a combination thereof; and

wherein the two-component or multi-component coating system is substantially water-free.

2. The thermally curable, liquid mixture of claim 1 , wherein the at least one phosphonic diester (A) is selected from the group consisting of acyclic phosphonic diesters and cyclic phosphonic diesters, and wherein the at least one diphosphonic diester (A) is selected from the group consisting of acyclic diphosphonic diesters and cyclic diphosphonic diesters.

3. The thermally curable, liquid mixture of claim 2 , comprising at least one acyclic phosphonic diester having the general formula I:

wherein R 1 and R 2 are identical or different from one another and are selected from the group consisting of:

substituted and unsubstituted alkyl- having 1 to 20 carbon atoms, cycloalkyl- having 3 to 20 carbon atoms, and aryl- having 5 to 20 carbon atoms, the hyphen symbolizing in each case the covalent bond between a carbon atom of the radical R 1 or R 2 and the oxygen atom of the O—P group;

substituted and unsubstituted alkylaryl-, arylalkyl-, alkylcycloalkyl-, cycloalkylalkyl-, arylcycloalkyl-, cycloalkylaryl-, alkylcycloalkylaryl-, alkylarylcycloalkyl-, arylcycloalkylalkyl-, arylalkylcycloalkyl-, cycloalkylalkylaryl-, and cycloalkylarylalkyl-, the alkyl, cycloalkyl-, and aryl groups therein each containing the above-recited number of carbon atoms and the hyphen symbolizing in each case the covalent bond between a carbon atom of the radical R 1 and R 2 and the oxygen atom of the O—P group; and

substituted and unsubstituted radical- of the above-recited kind, containing at least one heteroatom selected from the group consisting of oxygen atom, sulfur atom, nitrogen atom, phosphorus atom, and silicon atom, the hyphen symbolizing the covalent bond between a carbon atom of the radical and the oxygen atom of the O—P group.

4. The thermally curable, liquid mixture of claim 1 , further comprising at least one additive (D).

5. A cured material, comprising the product of thermally curing a mixture according to claim 1 .

6. The cured material of claim 5 , comprising moldings, sheets, coatings, adhesive layers, seals, or a combination thereof.

7. The thermally curable, liquid mixture of claim 3 , wherein R 1 and R 2 are identical or different from one another and are selected from the group consisting of phenyl, methyl, and ethyl.

8. The thermally curable, liquid mixture of claim 7 , wherein R 1 and R 2 are phenyl.

9. The thermally curable, liquid mixture of claim 1 , wherein at least one additive (D) is present as the separate component (II).

10. The thermally curable, liquid mixture of claim 4 , wherein the at least one phosphonic diester (A), at least one diphosphonic diester (A), or at least one phosphonic diester and at least one diphosphonic diester (A) is present in component (II).

11. The thermally curable, liquid mixture of claim 1 , wherein the at least one first compound (B) is a (co)polymer of olefinically unsaturated monomers.

12. The thermally curable, liquid mixture of claim 1 , wherein the at least one phosphonic diester (A), at least one diphosphonic diester (A), or at least one phosphonic diester and at least one diphosphonic diester (A) is present in component (I).

13. A process for preparing a thermally curable, liquid mixture, comprising:

mixing:

compounds (A) in an amount of 0.1 to 20 wt. %, wherein (A) comprises: at least one phosphonic diester (A), at least one diphosphonic diester (A), or at least one phosphonic diester and at least one diphosphonic diester (A),

at least one first compound (B) comprising at least two reactive functional groups comprising hydroxyl groups, which is selected from the group consisting of addition resins, condensation resins, and (co)polymers of olefinically unsaturated monomers; and

at least one second compound (B) comprising N-hydroxyalkyamino groups, N-alkoxyalkylamino groups, or a combination thereof, which is an amino resin and can be reacted by transesterification, transamidation, self-condensation of N-hydroxyalkylamino groups, self-condensation of N-alkoxyalkylamino groups, transacetalization of N-alkoxyalkylamino groups, acetalization of N-hydroxyalkylamino groups, or a combination thereof; and

at least one polyisocyanate (C) comprising at least two free isocyanate groups; and

homogenizing the resultant mixture,

wherein the thermally curable, liquid mixture is a two-component or multi-component coating system, the two-component or multi-component coating system comprising the at least one first compound (B) comprising at least two reactive functional groups as a separate component (I) and the at least one polyisocyanate (C) as a separate component (II);

wherein a proportion of (B):(C) is in the range of 0.01 to 100, wherein (B) includes the total of the at least one first compound (B) comprising at least two reactive functional groups and the at least one second compound (B) comprising N-hydroxyalkylamino groups, N-alkoxyalkylamino groups, or a combination thereof; and

wherein the two-component or multi-component coating system is substantially water-free.

14. The thermally curable, liquid mixture of claim 3 , wherein at least one acyclic phosphonic diester having the general formula I and R 1 and R 2 are identical or different from one another are selected from the group consisting of substituted and unsubstituted alkyl- having 1 to 20 carbon atoms, cycloalkyl- having 3 to 20 carbon atoms, and aryl- having 5 to 20 carbon atoms, the hyphen symbolizing in each case the covalent bond between a carbon atom of the radical R 1 or R 2 and the oxygen atom of the O—P group.

15. The process of claim 13 , further comprising mixing at least one additive (D).

16. The process of claim 13 , further comprising:

mixing the at least one polyisocyanate (C), and optionally, at least one additive (D) to form the separate component (II);

mixing the separate component (II) with the mixture of the other components; and

homogenizing the resultant mixture.

17. The process of claim 16 wherein the at least one phosphonic diester (A), at least one diphosphonic diester (A), or at least one phosphonic diester and at least one diphosphonic diester (A) is present in component (II).

18. The process of claim 13 , further comprising thermally curing the resultant mixture.

19. The process for preparing a thermally curable, liquid mixture of claim 13 , wherein the at least one first compound (B) is a (co)polymer of olefinically unsaturated monomers.

20. The process for preparing a thermally curable, liquid mixture of claim 13 , wherein the at least one phosphonic diester (A), at least one diphosphonic diester (A), or at least one phosphonic diester and at least one diphosphonic diester (A) is present in component (I).

21. The process for preparing a thermally curable, liquid mixture of claim 13 , wherein at least one acyclic phosphonic diester having the general formula I and R 1 and R 2 are identical or different from one another are selected from the group consisting of substituted and unsubstituted alkyl- having 1 to 20 carbon atoms, cycloalkyl- having 3 to 20 carbon atoms, and aryl- having 5 to 20 carbon atoms, the hyphen symbolizing in each case the covalent bond between a carbon atom of the radical R 1 or R 2 and the oxygen atom of the O—P group.

22. A thermally curable mixture, comprising:

compounds (A) in an amount of 0.1 to 20 wt. %, wherein (A) comprises: at least one phosphonic diester (A), at least one diphosphonic diester (A), or at least one phosphonic diester and at least one diphosphonic diester (A);

at least one first compound (B) comprising hydroxyl groups, which is selected from the group consisting of addition resins, condensation resins, and (co)polymers of olefinically unsaturated monomers; and at least one second compound (B) comprising N-hydroxyalkylamino groups, N-alkoxyalkylamino groups, or a combination thereof, which is an amino resin and can be reacted by transesterification, transamidation, self-condensation of N-hydroxyalkylamino groups, self-condensation of N-alkoxyalkylamino groups, transacetalization of N-alkoxyalkylamino groups, acetalization of N-hydroxyalkylamino groups, or a combination thereof; and

at least one polyisocyanate (C) comprising at least two free isocyanate groups;

wherein the at least one phosphonic diester is a cyclic phosphonic diester having the general formula II:

the at least one diphosphonic diester is an acyclic diphosphonic diester having the general formula III:

(R 1 —O)(O)PH—O—PH(O)(O—R 2 )  (III); or

a cyclic diphosphonic diester having the general formula IV:

wherein R 1 and R 2 are identical or different from one another and are selected from the group consisting of:

substituted and unsubstituted alkyl- having 1 to 20 carbon atoms, cycloalkyl- having 3 to 20 carbon atoms, and aryl- having 5 to 20 carbon atoms, the hyphen symbolizing in each case the covalent bond between a carbon atom of the radical R 1 or R 2 and the oxygen atom of the O—P group;

substituted and unsubstituted alkylaryl-, arylalkyl-, alkylcycloalkyl-, cycloalkylalkyl-, arylcycloalkyl-, cycloalkylaryl-, alkylcycloalkylaryl-, alkylarylcycloalkyl-, arylcycloalkylalkyl-, arylalkylcycloalkyl-, cycloalkylalkylaryl-, and cycloalkylarylalkyl-, the alkyl, cycloalkyl-, and aryl groups therein each containing the above-recited number of carbon atoms and the hyphen symbolizing in each case the covalent bond between a carbon atom of the radical R 1 and R 2 and the oxygen atom of the O—P group; and

substituted and unsubstituted radical- of the above-recited kind, containing at least one heteroatom selected from the group consisting of oxygen atom, sulfur atom, nitrogen atom, phosphorus atom, and silicon atom, the hyphen symbolizing the covalent bond between a carbon atom of the radical and the oxygen atom of the O—P group; and

wherein R 3 and R 4 are identical or different from one another and are selected from the group consisting of:

substituted and unsubstituted, divalent alkyl- having 1 to 20 carbon atoms, cycloalkyl having 3 to 20 carbon atoms, and aryl- having 5 to 20 carbon atoms, the hyphen symbolizing in each case the covalent bond between a carbon atom of the radical R 3 or R 4 and the oxygen atom of the O—P group;

substituted and unsubstituted, divalent alkylaryl-, arylalkyl-, alkylcycloalkyl-, cycloalkylalkyl-, arylcycloalkyl-, cycloalkylaryl-, alkylcycloalkylaryl-, alkylarylcycloalkyl-, arylcycloalkylalkyl-, arylalkylcycloalkyl-, cycloalkylalkylaryl-, and cycloalkylarylalkyl-, the alkyl, cycloalkyl-, and aryl groups therein each containing the above-recited number of carbon atoms and the hyphen symbolizing in each case the covalent bond between a carbon atom of the radical R 3 and R 4 and the oxygen atom of the O—P group; and

substituted and unsubstituted, divalent radical- of the above-recited kind, containing at least one heteroatom selected from the group consisting of oxygen atom, sulfur atom, nitrogen atom, phosphorus atom, and silicon atom, the hyphen symbolizing the covalent bond between a carbon atom of the radical and the oxygen atom of the O—P group; and

wherein Z is a covalent bond between an atom of the radical R 3 and an atom of the radical R 4 or is a divalent linking group selected from the group consisting of oxygen atom, substituted and unsubstituted sulfur atom, substituted nitrogen atom, substituted phosphorus atom, substituted silicon atom, substituted and unsubstituted alkyl having 1 to 10 carbon atoms,

cycloalkyl having 3 to 10 carbon atoms, and aryl having 5 to 10 carbon atoms, said alkyl, cycloalkyl, and aryl being free from heteroatoms or containing at least one heteroatom selected from the group consisting of oxygen atom, sulfur atom, nitrogen atom, phosphorus atom, and silicon atom,

wherein the thermally curable, liquid mixture is a two-component or multi-component coating system, the two-component or multi-component coating system comprising the at least one compound (B) as a separate component (I) and the at least one polyisocyanate (C) as a separate component (II);

wherein a proportion of (B):(C) is in the range of 0.1:100 to 1:10, wherein (B) includes the total of the at least one first compound (B) comprising at least two reactive functional groups and the at least one second compound (B) comprising N-hydroxyalkylamino groups, N-alkoxyalkylamino groups, or a combination thereof; and

wherein the two-component or multi-component coating system is substantially water-free.

23. The thermally curable mixture of claim 22 , wherein R 1 and R 2 are identical or different from one another, and are selected from the group consisting of phenyl, methyl, and ethyl.

24. The thermally curable mixture of claim 23 , wherein R 1 and R 2 are phenyl.

25. The thermally curable mixture of claim 22 , wherein the at least one first compound (B) is a (co)polymer of olefinically unsaturated monomers.

26. The thermally curable mixture of claim 22 , wherein the at least one phosphonic diester (A), at least one diphosphonic diester (A), or at least one phosphonic diester and at least one diphosphonic diester (A) is present in component (I).

27. The thermally curable mixture of claim 22 , wherein the at least one phosphonic diester (A), at least one diphosphonic diester (A), or at least one phosphonic diester and at least one diphosphonic diester (A) is present in component (II).

28. A thermally curable, liquid mixture, comprising:

compound (A) in an amount of 0.1 to 20 wt. %, wherein compound (A) comprises: at least one acyclic phosphonic diester having the general formula I:

wherein R 1 and R 2 are identical or different from one another and are selected from the group consisting of:

substituted and unsubstituted alkyl- having 1 to 20 carbon atoms, cycloalkyl- having 3 to 20 carbon atoms, and aryl- having 5 to 20 carbon atoms, the hyphen symbolizing in each case the covalent bond between a carbon atom of the radical R 1 or R 2 and the oxygen atom of the O—P group;

at least one first compound (B) comprising a hydroxyl-functional (co)polymer of olefinically unsaturated monomers;

at least one second compound (B) comprising an amino resin;

at least one polyisocyanate (C) comprising at least two free isocyanate groups;

wherein the thermally curable, liquid mixture is a two-component or multi-component coating system, the two-component or multi-component coating system comprising the at least one first compound (B) as a separate component (I) and the at least one polyisocyanate (C) as a separate component (II);

a proportion of (B):(C) is in the range of 0.01 to 100, wherein (B) includes the total of the at least one first compound (B) and the at least one second compound (B);

the at least one acyclic phosphonic diester compound (A) is present in component (II); and

the two-component or multi-component coating system is substantially water-free.

Assignments (2)
CHANGE OF NAME Recorded Aug 7, 2013
From: POPPE, ANDREAS; WESTHOFF, ELKE; GEBAUER, BEATE; MAYENFELS, PETER
To: BASF COATINGS GMBH
Reel/Frame 030962/0069 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 21, 2008
From: POPPE, ANDREAS; WESTHOFF, ELKE; GEBAUER, BEATE; MAYENFELS, PETER
To: BASF COATINGS AKTIENGESELLSCHAFT
Reel/Frame 020683/0557 →
Priority Claims (1)
DE 10 2005 045 150 · Sep 22, 2005 · national
Continuity (1)
Related Publication 20080245998A1 · Oct 9, 2008