Method and apparatus for manufacturing a semiconductor device
View Patent ↗The present invention relates to a method of manufacturing a semiconductor device wherein etching is performed on films on a wafer using a plasma treatment apparatus. In the manufacturing method according to the present invention, a change in the difference between the emission intensities of a first wavelength component and a second wavelength component in plasma is monitored during etching. If the amount of change in the difference per unit time exceeds a predetermined threshold a given number of times in a row, then the flow rate of oxygen introduced to the plasma treatment apparatus is increased or, if the amount of change exceeding the predetermined threshold has not been seen, then the oxygen flow rate is set back to the original value thereof. This series of actions is repeated all the time during a set period of time.
1. A method of manufacturing a semiconductor device wherein etching is performed on films on a wafer using a plasma treatment apparatus, said manufacturing method comprising:
monitoring changes in the emission intensities of a first wavelength component and a second wavelength component in plasma during etching;
calculating a rate of change of a difference between the emission intensities of the first and second wavelength components, and increasing the flow rate of oxygen introduced to said plasma treatment apparatus if the rate of change exceeds a predetermined threshold within a predetermined period of processing time; and
setting said oxygen flow rate back to the original value thereof if said rate of change exceeding said predetermined threshold is no longer seen.
2. The method of manufacturing a semiconductor device according to claim 1 , wherein a determination as to whether said rate of change exceeds said predetermined threshold is made when the rate of change exceeds a predetermined threshold a given number of times in a row during etching.
3. The method of manufacturing a semiconductor device according to claim 1 , wherein said first wavelength component is a CFx radical having an emission wavelength of 260 nm and said second wavelength component is a SiFx radical having an emission wavelength of 440 nm.
4. The method of manufacturing a semiconductor device according to claim 1 , wherein the monitoring of the changes in the emission intensities of the first and second wavelength components comprises performing a plurality of measurements of the emission intensities of the first and second wavelength components over time.
5. The method of manufacturing a semiconductor device according to claim 4 , wherein the calculating of the rate of change is based on the plurality of measurements.
6. The method of manufacturing a semiconductor device according to claim 5 , wherein the calculating of the rate of change comprises continuously calculating the rate of change.
7. The method of manufacturing a semiconductor device according to claim 4 , further comprising:
after the increasing of the flow rate of oxygen, continuing the monitoring of the changes in the emission intensities of the first and second wavelength components, and continuing the calculating of the rate of change of the emission intensities of the first and second wavelength components.
8. The method of manufacturing a semiconductor device according to claim 1 , wherein the predetermined threshold comprises a change of 0.5% during one second and the given number of times comprises three or more times.
9. The method of manufacturing a semiconductor device according to claim 1 , wherein the increasing of the flow rate of oxygen comprises increasing the flow rate of oxygen to be in a range from 1.5 times a flow rate of oxygen at the time of beginning the increasing of the flow rate of oxygen, to 2 times the flow rate of oxygen at the time of beginning the increasing of the flow rate of oxygen.
10. The method of manufacturing a semiconductor device according to claim 1 , further comprising:
determining the period of processing time during which etch stop may occur during the etching.
11. The method of manufacturing a semiconductor device according to claim 10 , wherein the monitoring of the changes in the emission intensities, and the calculating of the rate of change are performed until an end of the predetermined period of processing time.
12. The method of manufacturing a semiconductor device according to claim 10 , wherein the determining of the period of processing time comprises determining the period of processing time based on a depth of a hole to be formed by the etching and a predicted end time of the etching.