Semiconductor integrated circuit with multi-cut via and automated layout method for the same
View Patent ↗A semiconductor integrated circuit according to an embodiment of the invention includes a single-cut via 60 and a multi-cut via 30 that includes a first via 30 a and a second via 30 b . An overhang (OHa or OHb) with respect to at least one of the first via 30 a and the second via 30 b is smaller than an overhang OH with respect to the single-cut via 60.
1. A semiconductor integrated circuit comprising:
a first wiring formed on a first wiring layer and prolonged in a first direction;
a second wiring formed on a second wiring layer and prolonged in a second direction; and
a multi-cut via formed to connect the first wiring to the second wiring, the multi-cut via including a first via and a second via formed in the first direction, a distance between the first via and the second via being longer than a width of the second wiring,
wherein an overhang with respect to the first via is different from an overhang with respect to the second via.
2. The semiconductor integrated circuit according to claim 1 , wherein the overhang with respect to any of the first via and the second via is smaller than an overhang with respect to a single-cut via.
3. The semiconductor integrated circuit according to claim 1 , further comprising:
a third wiring adjacent to the second wiring formed on the second wiring layer, wherein the first via is formed at a point closer to the third wiring than the second via and an overhang with respect to the first via is smaller than the overhang with respect to the second via.
4. A layout method of a semiconductor integrated circuit comprising:
forming, using a layout tool executed by a processor on a computer, a first wiring on a first wiring layer, the first wiring being prolonged in a first direction;
forming, using the layout tool, a second wiring on a second wiring layer, the second wiring layer being prolonged in a second direction; and
forming, using the layout tool, a multi-out via to connect the first wiring to the second wiring, the multi-cut via including a first via and a second via formed in the first direction, a distance between the first via and the second via being longer than a width of the second wiring,
wherein an overhang with respect to the first via is different from an overhang with respect to the second via.
5. The layout method according to claim 4 , wherein an overhang with respect to any of the first via and the second via is smaller than the overhang with respect to a single-cut via.
6. The layout method according to claim 4 , further comprising forming a third wiring adjacent to the second wiring on the second wiring layer,
wherein the first via is formed at a point closer to the third wiring than the second via and the overhang with respect to the first via is smaller than the overhang with respect to the second via.