Semiconductor device and method for manufacturing the same
View Patent ↗A COF which can effectively dissipate the heat by using a simple structure and its manufacturing method. A semiconductor device of COF, which is formed over the main surface of a flexible substrate having no device hole and where a semiconductor chip is mounted over the inner lead interconnection, is characterized by forming a first resin layer over the second main surface of the flexible substrate opposite the side where the semiconductor chip is mounted and at the position corresponding to the semiconductor chip.
1. A semiconductor device, comprising:
a semiconductor chip mounted over a first surface of a continuous flexible substrate,
wherein a first resin layer is formed over a second surface of said continuous flexible substrate opposite a side where the semiconductor chip is mounted and at a position corresponding to said semiconductor chip,
wherein a second resin layer is filled between said continuous flexible substrate and said semiconductor chip, and
wherein said first resin layer comprises a divided plurality of resins or a resin which has one or more slits.
2. A semiconductor device, comprising:
a semiconductor chip mounted over a first surface of a continuous flexible substrate,
wherein a first resin layer is formed over a second surface of said continuous flexible substrate opposite a side where the semiconductor chip is mounted and at a position corresponding to said semiconductor chip,
wherein a second resin layer is filled between said continuous flexible substrate and said semiconductor chip, and
wherein said first resin layer has a surface with roughness.
3. A semiconductor device, comprising:
a semiconductor chip mounted over a first surface of a continuous flexible substrate,
wherein a first resin layer is formed over a second surface of said continuous flexible substrate opposite a side where the semiconductor chip is mounted and at a position corresponding to said semiconductor chip,
wherein a second resin layer is filled between said continuous flexible substrate and said semiconductor chip, and
wherein said first resin layer has substantially the same size as said second resin layer.
4. A semiconductor device, comprising:
a semiconductor chip mounted over a first surface of a continuous flexible substrate,
wherein a first resin layer is formed over a second surface of said continuous flexible substrate opposite a side where the semiconductor chip is mounted and at a position corresponding to said semiconductor chip,
wherein a second resin layer is filled between said continuous flexible substrate and said semiconductor chip, and
wherein said first resin layer and said second resin layer include different materials have different fillers.