IP Library › Granted Patent US 8,753,714
Granted Patent B2
US 8,753,714 · App. 12/080,256 · Granted Jun 17, 2014

Forming or patterning composite microstructures using microfluidics

Inventors: Yuk Kee Cheung (Sai Wan Ho, HK); Samuel Sia (New York, NY)
Assignee: The Trustees of Columbia University in the City of New York
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,753,714
App. No.
12/080,256
Granted
Jun 17, 2014
Kind
B2
Abstract

Techniques comprising systems and methods for forming or pattering microstructures using microfluidics are described. A target structure can include a microchannel passage with a chamber into which a light hardenable material can be injected and selectively exposed to light to adhere to a desired location of a substrate. Unhardened material can be washed out of the chamber. One or more subsequent cycles can repeat the process using the same or a different material. A variety of composite microstructures can be created, including structures encapsulating viable living cells, such as for cell study or tissue engineering.

Claims (18)

1. A method for forming a composite structure, the method comprising:

flowing a first precursor solution into an assembly region;

exposing at least a first portion of the assembly region to light such that the first precursor solution in at least said first portion of the assembly region is polymerized into a first polymer section;

flowing a second precursor solution into the assembly region; and

exposing at least a second portion of the assembly region to light such that the second precursor solution in at least said second portion of the assembly region is polymerized into a second polymer section,

wherein the first polymer section has a material property different from that of the second polymer section, and

the exposing at least a first portion to light and the exposing at least a second portion to light are performed using light from a confocal laser scanning microscope.

2. The method of claim 1 , wherein the material property is a porosity of the respective polymer section.

3. The method of claim 1 , wherein the material property is a stiffness of the respective polymer section.

4. The method of claim 1 , wherein the first polymer section has a different material composition from that of the second polymer section.

5. The method of claim 1 , wherein the first and second polymer sections form a composite, anisotropic hydrogel structure.

6. The method of claim 1 , wherein said assembly region is a region of a microfluidic channel having a dimension less than 1 mm.

7. The method of claim 1 , wherein the first and second precursor solutions include respective prepolymers and photoinitiators.

8. The method of claim 1 , wherein the first precursor solution or the second precursor solution includes a polyethylene glycol (PEG) based prepolymer.

9. The method of claim 1 , wherein the first precursor solution or the second precursor solution includes a polyethylene glycol based prepolymer with adhesion peptides.

10. The method of claim 1 , further comprising seeding at least one of the first and second polymer sections with living cells.

11. The method of claim 1 , wherein the assembly region has a height, and at least one of the first and second polymer sections has a height in a direction parallel to said assembly region height that is less than said assembly region height.

12. The method of claim 1 , wherein at least a portion of the first polymer section overlaps at least a portion of the second polymer section in plan view.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 1, 2008
From: CHEUNG, YUKKEE; SIA, SAMUEL
To: THE TRUSTEES OF COLUMBIA UNIVERSITY IN THE CITY OF NEW YORK
Reel/Frame 021615/0899 →
Continuity (2)
Provisional Application 60921357 · Apr 2, 2007
Related Publication 20080286482A1 · Nov 20, 2008