Method of manufacturing a semiconductor device
View Patent ↗The invention aims to provide substrate treatment equipment that can automatically collect a substrate in a normal condition without needing manual operation. The equipment includes a substrate holder 26 for holding substrates 12 in a multistage manner and a substrate transfer unit 34 for transferring the substrates 12 into the substrate holder 26 , wherein a substrate holding condition of the substrate holder 26 is sensed by a sensing section 60 . The sensing section 60 has photo-sensors 64 a, 64 b , and sensing waveforms sensed by the photo-sensors 64 a, 64 b are compared with a normal waveform. A control section 66 is provided, which controls a substrate transfer unit 34 such that substrates 12 other than at least a substrate 12 that was determined to be abnormal are transferred by the unit.
1. A manufacturing method of a semiconductor device, comprising:
inserting a substrate holder on which substrates are held in a multistage manner in a substantially vertical direction into a substrate treatment chamber,
performing heat treatment to the substrates in the substrate treatment chamber,
sensing a holding condition of the substrates held in the substrate holder, and
transferring substrates other than a substrate determined to be abnormal and at least one of the substrates contacting the substrate determined to be abnormal in the substrate holder by a substrate transfer unit, wherein in transferring substrates, when all of a predetermined number of substrates to be carried are determined to be normal in the substrate holder, all of the predetermined number of substrates are carried together, and when at least one of the predetermined number of substrates is determined to be abnormal in the substrate holder, substrates other than the substrate determined to be abnormal in the predetermined number of substrates and the at least one of the substrates contacting the substrate determined to be abnormal in the substrate holder are carried one at a time.
2. A manufacturing method of a semiconductor device comprising:
inserting a substrate holder on which substrates are held in a multistage manner in a substantially vertical direction into a substrate treatment chamber,
performing heat treatment to the substrates in the substrate treatment chamber,
sensing a holding condition of the substrates held in the substrate holder, and
transferring substrates by a substrate transfer unit, wherein when all of a predetermined number of substrates to be carried are determined to be normal in the substrate holder, all of the predetermined number of substrates are carried together, and when at least one of the predetermined number of substrates is determined to be abnormal in the substrate holder, substrates other than the substrate determined to be abnormal in the predetermined number of substrates are carried one at a time.
3. A transferring method of a substrate comprising:
inserting a substrate holder on which substrates are held in a multistage manner in a substantially vertical direction into a substrate treatment chamber,
performing heat treatment to the substrates in the substrate treatment chamber,
sensing a holding condition of the substrates held in the substrate holder, and
transferring substrates other than a substrate determined to be abnormal and at least one of the substrates contacting the substrate determined to be abnormal in the substrate holder by a substrate transfer unit, wherein in transferring substrates, when all of a predetermined number of substrates to be carried are determined to be normal in the substrate holder, all of the predetermined number of substrates are carried together, and when at least one of the predetermined number of substrates is determined to be abnormal in the substrate holder, substrates other than the substrate determined to be abnormal in the predetermined number of substrates and the at least one of the substrates contacting the substrate determined to be abnormal in the substrate holder are carried one at a time.