IP Library Granted Patent US 8,545,634
Granted Patent B2
US 8,545,634 · App. 12/090,186 · Granted Oct 1, 2013

System and method for cleaning a conditioning device

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Quick Facts
Patent No.
US 8,545,634
App. No.
12/090,186
Granted
Oct 1, 2013
Kind
B2
Abstract

A system for cleaning a conditioning device to improve the efficiency of the conditioning of a polishing pad using the conditioning device as part of a chemical-mechanical polishing process, the system comprising a conditioning device; a fluid dispenser arranged to dispense a fluid on the conditioning device; and an acoustic nozzle arranged to emit a megasonic or ultrasonic signal at the conditioning device while the fluid dispenser is dispensing the fluid on the conditioning device.

Claims (24)

1. A system for cleaning a conditioning device that is used to condition a polishing pad as part of a chemical-mechanical polishing process, the system comprising:

the conditioning device;

a fluid dispenser having a conduit arranged to inject a fluid onto a conditioning surface of the conditioning device and an acoustic nozzle arranged to emit a megasonic or ultrasonic signal onto the conditioning surface of the conditioning device while the fluid dispenser is injecting the fluid onto the conditioning surface; and

means for monitoring a condition of the conditioning surface of the conditioning device, wherein the means for monitoring includes an optical system having a laser emitter for emitting a laser beam at the conditioning surface of the conditioning device and a light sensor for determining an intensity of reflected laser light from the conditioning surface, wherein the conditioning surface of the conditioning device includes a diamond disk having an arrangement of diamonds coated on a surface of the diamond disk.

2. A system according to claim 1 , wherein the fluid dispenser is arranged to dispense deionised water.

3. A system according to claim 1 , wherein the fluid dispenser is arranged to dispense a chemical reagent.

4. A systems according to claim 3 , wherein the dispensed chemical reagent is NH 4 OH or KOH.

5. A system according to claim 1 , wherein the means for monitoring comprises means for monitoring deterioration of the conditioning device.

6. A method for cleaning a conditioning device that is used to condition a polishing pad as part of a chemical-mechanical polishing process, the method comprising:

injecting a fluid onto a conditioning surface of the conditioning device;

emitting a megasonic or ultrasonic signal onto the conditioning surface of the conditioning device while the fluid is being injected onto the conditioning surface; and

monitoring a condition of the conditioning surface of the conditioning device, wherein monitoring the condition comprises emitting a laser beam at a conditioning surface of the conditioning device and determining an intensity of reflected laser light from the conditioning surface, wherein the conditioning surface of the conditioning device includes a diamond disk having an arrangement of diamonds coated on a surface of the diamond disk.

7. The method of claim 6 , wherein the fluid includes deionised water.

8. The method of claim 6 , wherein the fluid includes a chemical reagent.

9. The method of claim 8 , wherein the chemical reagent is NH 4 OH or KOH.

10. The method of claim 6 , wherein monitoring the condition comprises monitoring deterioration of the conditioning device.

11. A system according to claim 1 , wherein the means for monitoring is to compare the intensity of light to a threshold.

12. The method of claim 6 , further comprising comparing the intensity of reflected laser light with a threshold.

13. The method of claim 12 , further comprising replacing the conditioning pad when the intensity is above the threshold.

14. A system for cleaning a conditioning device that is used to condition a polishing pad as part of a chemical-mechanical polishing process, the system comprising:

the conditioning device;

a fluid dispenser having a conduit arranged to inject a fluid onto a conditioning surface of the conditioning device and an acoustic nozzle arranged to emit a megasonic or ultrasonic signal onto the conditioning surface of the conditioning device while the fluid dispenser is injecting the fluid onto the conditioning surface; and

a monitoring technique comprising:

an optical system to monitor a condition of the conditioning surface of the conditioning device, the optical system having a laser emitter for emitting a laser beam at the conditioning surface of the conditioning device and a light sensor for determining an intensity of reflected laser light from the conditioning surface, wherein the conditioning surface of the conditioning device includes a diamond disk having an arrangement of diamonds coated on a surface of the diamond disk.

Assignments (23)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE APPLICATION NO. FROM 13,883,290 TO 13,833,290 PREVIOUSLY RECORDED ON REEL 041703 FRAME 0536. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS.. Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
Reel/Frame 048734/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041703/0536 →
CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE LISTED CHANGE OF NAME SHOULD BE MERGER AND CHANGE PREVIOUSLY RECORDED AT REEL: 040652 FRAME: 0180. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME. Recorded Jan 12, 2017
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 041354/0148 →
CHANGE OF NAME Recorded Nov 8, 2016
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 040652/0180 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 13, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037518/0292 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037356/0553 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037356/0143 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037354/0719 →
SECURITY AGREEMENT Recorded Nov 6, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 031591/0266 →
SECURITY AGREEMENT Recorded Jun 18, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 030633/0424 →
SECURITY AGREEMENT Recorded May 13, 2010
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 024397/0001 →
SECURITY AGREEMENT Recorded Mar 15, 2010
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A.
Reel/Frame 024085/0001 →
SECURITY AGREEMENT Recorded Sep 24, 2008
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A.
Reel/Frame 021570/0449 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 14, 2008
From: LAFON, JEAN-MARC; DELMONACO, SILVIO; PETITDIDIER, SEBASTIAN
To: FREESCALE SEMICONDUCTOR, INC.; ST MICROELECTRONICS CROLLES SAS; ST MICROELECTRONICS SRL
Reel/Frame 020799/0990 →