Granted Patent B2

US 7,883,393 · App. 12/093,113 · Granted Feb 8, 2011

Abstract

Claims (27)

1. A system for removing particles from a polishing pad to improve the efficiency of the removal of material by the polishing pad as part of a chemical-mechanical polishing process, the system comprising;

a polishing pad;

a fluid dispenser arranged to dispense a fluid on the polishing pad;

a heater for increasing the temperature of the fluid dispensed on the polishing pad while the polishing pad is polishing a substrate; and

a voltage circuit for coupling the polishing pad to a voltage source for repelling charged particles from the polishing pad surface while the fluid dispenser is dispensing the fluid on the polishing pad.

2. A system according to claim 1 , wherein the fluid dispenser is arranged to dispense deionised water.

3. A system according to claim 2 , wherein the fluid dispenser is arranged to dispense a chemical reagent.

4. A system according to claim 1 , wherein the fluid dispenser is arranged to dispense a chemical reagent.

5. A system according to claim 4 , wherein the chemical reagent is a chemical suitable to remove slurry by-products.

6. A system according to claim 1 , further comprising an acoustic nozzle arranged to emit an ultrasonic or megasonic signal at the polishing pad while the fluid dispenser is dispensing the fluid on the polishing pad.

7. A system according to claim 6 , wherein the acoustic nozzle is capable of operating at a frequency in a range of 0.7 to 1.2 MHz.

8. A system according to claim 7 , wherein the fluid dispenser is arranged to dispense fluid and the acoustic nozzle is arranged to emit a megasonic signal while the polishing pad is polishing a substrate.

9. A system according to claim 6 , wherein the fluid dispenser is arranged to dispense fluid and the acoustic nozzle is arranged to emit a megasonic signal while the polishing pad is polishing a substrate.

10. The system of claim 1 , wherein the system comprises the heater.

11. A system according to claim 10 , wherein the heater is arranged to heat the fluid to a temperature above 25 degrees Celsius.

12. The system of claim 1 , wherein the system comprises the voltage circuit.

13. A system according to claim 12 , wherein the voltage source is arranged to alternate to allow opposite charged particles to be removed from the polishing pad.

14. A system according to claim 12 , wherein the voltage source is configured to operate at a voltage in a range of 0.1 and 10 volts.

15. A system according to claim 12 , wherein the polishing pad is arranged to be conductive.

16. The system of claim 1 , wherein the fluid dispenser comprises a conduit, wherein the heater is coupled to the conduit.

17. A method for removing particles from a polishing pad to improve the efficiency of the removal of material by the polishing pad as part of a chemical-mechanical polishing process, the method comprising:

dispensing a fluid on the polishing pad;

increasing the temperature of the fluid dispensed on the polishing pad while the polishing pad is polishing a substrate; and

coupling the polishing pad to a voltage source for repelling charged particles from the polishing pad surface while dispensing the fluid on the polishing pad.

18. The method of claim 17 , wherein increasing the temperature comprises heating the fluid to a temperature in a range of 25 to 60° C.

19. The method of claim 17 , wherein the method includes alternating a voltage of the voltage source at a frequency in a range of 0.1 to 10 Hz.

20. The method of claim 17 , wherein increasing the temperature of the fluid comprises heating the fluid while the fluid is within a conduit.

Assignments (24)