Compound semiconductor light-emitting device and method for manufacturing the same
A compound semiconductor light-emitting device which includes an n-type semiconductor layer, a light-emitting layer and a p-type semiconductor layer, that are made of a compound semiconductor, formed on a substrate, the n-type semiconductor layer and the p-type semiconductor layer are stacked so as to interpose the light-emitting layer therebetween, a first conductive transparent electrode and a second conductive electrode. The first conductive transparent electrode is made of an IZO film containing an In 2 O 3 crystal having a bixbyite structure. Also discussed is a method of manufacturing the device.
1. A method for manufacturing a compound semiconductor light-emitting device, which comprises steps (a) to (c) shown below:
(a) a step of manufacturing a semiconductor wafer by stacking an n-type semiconductor layer, a light-emitting layer and a p-type semiconductor layer, that are made of a gallium nitride-based compound semiconductor, on a substrate, the n-type semiconductor layer and the p-type semiconductor layer being stacked so as to interpose the light-emitting layer therebetween,
(b) a step of stacking an amorphous IZO film on the p-type semiconductor layer, and
(c) a step of crystallizing the amorphous IZO film, wherein the step of crystallizing the amorphous IZO film is performed by a heat treatment at a temperature of from 700° C. to 900° C. in an O 2 free atmosphere.
2. The method for manufacturing a compound semiconductor light-emitting device according to claim 1 , wherein the step of stacking an amorphous IZO film on the p-type semiconductor layer is performed by a sputtering method.
3. The method for manufacturing a compound semiconductor light-emitting device according to claim 1 , wherein the heat treatment is performed in an N 2 gas atmosphere or in a mixed gas atmosphere of N 2 and H 2 .