IP Library Granted Patent US 8,026,118
Granted Patent B2
US 8,026,118 · App. 12/096,827 · Granted Sep 27, 2011

Gallium nitride based compound semiconductor light-emitting device and method for manufacturing same

Assignee: Showa Denko K.K.
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Quick Facts
Patent No.
US 8,026,118
App. No.
12/096,827
Granted
Sep 27, 2011
Kind
B2
Abstract

The present invention provides a gallium nitride based compound semiconductor light-emitting device having high light emission efficiency and a method of manufacturing the same. The gallium nitride based compound semiconductor light-emitting device includes: a substrate 11 ; an n-type semiconductor layer 13 , a light-emitting layer 14 , and a p-type semiconductor layer 15 that are composed of gallium nitride based compound semiconductors and formed on the substrate 11 in this order; a transparent positive electrode 16 that is formed on the p-type semiconductor layer 15 ; a positive electrode bonding pad 17 that is formed on the transparent positive electrode 16 ; a negative electrode bonding pad 18 that is formed on the n-type semiconductor layer 13 ; and an uneven surface that has random convex portions formed thereon and is provided on at least a portion of the surface 16 a of the transparent positive electrode 16.

Claims (12)

1. A method of manufacturing a gallium nitride based compound semiconductor light-emitting device, the method comprising:

(1) a process of sequentially forming on a substrate an n-type semiconductor layer, a light-emitting layer, and a p-type semiconductor layer, and a transparent positive electrode, the n-type semiconductor layer, the light-emitting layer, and the p-type semiconductor layer each composed of a gallium nitride based compound semiconductor;

(2) a process of forming a mask made of metal particles on the surface of the transparent positive electrode; and

(3) a process of performing dry etching on the transparent positive electrode using the mask,

wherein the metal particles of the mask are made of Ni, or a Ni alloy.

2. The method of manufacturing a gallium nitride based compound semiconductor light-emitting device according to claim 1 ,

wherein the process ( 2 ) includes:

forming a metal thin film on the surface of the transparent positive electrode; and

performing a heat treatment.

3. The method of manufacturing a gallium nitride based compound semiconductor light-emitting device according to claim 1 ,

wherein an uneven surface is formed on at least a portion of the surface of the transparent positive electrode by wet etching.

4. A lamp comprising the gallium nitride based compound semiconductor light-emitting device manufactured by the method according to claim 1 .

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 18, 2012
From: SHOWA DENKO KABUSHIKI KAISHA
To: TOYODA GOSEI CO., LTD.
Reel/Frame 029489/0249 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 10, 2008
From: SHINOHARA, HIRONAO; OSAWA, HIROSHI
To: SHOWA DENKO K.K.
Reel/Frame 021071/0997 →
Priority Claims (1)
JP 2005-360290 · Dec 14, 2005 · national
Continuity (1)
Related Publication 20090309119A1 · Dec 17, 2009