Leadframe for packaged electronic device with enhanced mold locking capability
View Patent ↗A packaged electronic device ( 20 ) includes a die pad ( 30 ), leads ( 32 ) arranged around the die pad ( 30 ), and a die ( 24 ) attached to an upper surface ( 34 ) of the die pad ( 30 ) and electrically connected to the leads ( 32 ). A packaging material ( 28 ) encapsulates the die pad ( 30 ), the die ( 24 ), and the leads ( 32 ). The die pad ( 30 ) includes indentations ( 42 ) formed in the upper surface ( 34 ) along a sidewall ( 38 ) of the die pad ( 30 ). The die pad ( 30 ) further includes indentations ( 44 ) formed in a lower surface ( 36 ) of the die pad ( 30 ) along the sidewall. The packaging material ( 28 ) fills the indentations ( 42, 44 ) thereby promoting adhesion between the die pad ( 30 ) and the packaging material ( 28 ) so that the die pad ( 30 ) and packaging material ( 28 ) cannot readily delaminate.
1. A leadframe for a packaged electronic device comprising:
a die pad having an upper surface, a lower surface, and a sidewall, said die pad exhibiting a thickness, said die pad including first indentations formed in said upper surface along said sidewall and second indentations formed in said lower surface along said sidewall, wherein each of said first and second indentations exhibits a three-dimensional continuously curved shape, said first indentations extend into said die pad from said upper surface by a first depth that is approximately one half of said thickness, and said second indentations extend into said die pad from said lower surface by a second depth that is approximately one half of said thickness; and
leads arranged around said die pad.
2. A leadframe as claimed in claim 1 wherein said first depth of said first indentations and said second depth of said second indentations are substantially equivalent.
3. A leadframe for a packaged electronic device comprising:
a die pad having an upper surface, a lower surface, and a sidewall, said die pad including first indentations formed in said upper surface along said sidewall and second indentations formed in said lower surface along said sidewall, wherein each of said first and second indentations exhibits a three-dimensional continuously curved shape, each of said first and second indentations are in a semi-circular shape in a first direction substantially parallel to said sidewall, and said each of said first and second indentations are in a quarter-circular shape in a second direction substantially perpendicular to said sidewall; and
leads arranged around said die pad.
4. A leadframe as claimed in claim 1 wherein said first and second indentations are at corners of said die pad at intersections of respective upper and lower surface with said sidewall.
5. A leadframe as claimed in claim 1 wherein said second indentations extending into said die pad from said lower surface are offset along said sidewall relative to said first indentations extending into said die pad from said upper surface.
6. A leadframe as claimed in claim 5 wherein a material portion of said die pad extends between said first indentations and said lower surface and said material portion of said die pad extends between said second indentations and said upper surface.
7. A leadframe as claimed in claim 1 wherein a material portion of said die pad extends between each of said first indentations and said material portion of said die pad extends between each of said second indentations.
8. A leadframe for a packaged electronic device comprising:
a die pad having an upper surface, a lower surface, and a sidewall, said die pad exhibiting a thickness, said die pad including first indentations and second indentations, said first indentations being formed on said upper surface along said sidewall and extending into said die pad from said upper surface by a first depth that is approximately one half of said thickness, said second indentations being formed on said lower surface along said sidewall and extending into said die pad from said lower surface by a second depth that is approximately one half of said thickness, said second indentations being offset along said sidewall relative to said first indentations, wherein each of said first and second indentations exhibits a three-dimensional continuously curved shape; and
leads arranged around said die pad.
9. A leadframe as claimed in claim 8 wherein each of said first and second indentations are in a semi-circular shape in a first direction substantially parallel to said sidewall, and said each of said first and second indentations are in a quarter-circular shape in a second direction substantially perpendicular to said sidewall.
10. A leadframe as claimed in claim 8 wherein a material portion of said die pad extends between said first indentations and said lower surface and said material portion of said die pad extends between said second indentations and said upper surface.
11. A leadframe as claimed in claim 8 wherein a material portion of said die pad extends between each of said first indentations and said material portion of said die pad extends between each of said second indentations.